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LP3907SQ-TJXIP/NOPB

Texas Instruments

LP3907SQ-TJXIP/NOPB by Texas Instruments

LP3907SQ-TJXIP/NOPB by Texas Instruments is a 24-terminal switching regulator with VOLTAGE-MODE control, offering a max output voltage of 3.5V and max current of 1A. Ideal for industrial applications, this chip carrier has a very thin profile and operates at temperatures ranging from -40 to 85°C.

Median Price

$2.498

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 712 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 1,309 parts In-Stock

1+ parts

$2.498

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1,309

$2.498

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Vyrian

USA . 5,413 parts In-Stock

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5,413

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Distributors (Availability)

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Semicontronic

India . 375 parts In-Stock

1+ parts

$2.240

100+ parts

$2.184

1k+ parts

$2.173

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-

375

$2.240

$2.184

$2.173

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Corphita

USA . 3,974 parts In-Stock

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$2.367

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3,974

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Corohmni

South Africa . 370 parts In-Stock

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$2.970

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370

$2.970

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Parana Technologies

USA . 264 parts In-Stock

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$14.318

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$14.770

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264

$14.318

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$14.770

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DigiPath Technology Company

USA . 115 parts In-Stock

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$15.766

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115

$15.766

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IDEA Electronic Components Group

UK . 1,471 parts In-Stock

1+ parts

$16.088

100+ parts

$15.284

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$14.479

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1,471

$16.088

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$14.479

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ChromeModa Solutions

Germany . 1,011 parts In-Stock

1+ parts

$16.088

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$13.192

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1,011

$16.088

$13.192

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QUARKTWIN TECHNOLOGY LTD

USA . 28,794 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the LP3907SQ-TJXIP/NOPB Switching Regulator & Controller. This innovative product boasts a wide range of applications, providing customers with exceptional value and benefits. From its surface mount design to its advanced control mode, this chip carrier offers a compact solution for various industrial needs. Trust in Texas Instruments for cutting-edge technology that delivers outstanding performance in a compact package.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on circuit boards without the need for through-hole components.

Package Shape: SQUARE

Square packages can provide better thermal performance and space utilization compared to other shapes.

No. of Terminals: 24

Provides multiple connection points for enhanced versatility in system integration and design.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where high temperature operation is required.

Control Mode: VOLTAGE-MODE

Offers precise voltage regulation and control for efficient power management.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant contact surface for stable electrical connections.

Nominal Input Voltage: 3.6 V

Optimal input voltage level for efficient power conversion and performance.

Maximum Output Current: 1 A

Capable of delivering sufficient current for powering various components in the system.

Control Technique: PULSE WIDTH MODULATION

PWM control technique allows for adjustable and efficient power delivery for different load conditions.

Switcher Config: BUCK

Buck configuration is ideal for step-down voltage conversion, making it suitable for a wide range of applications.

Technical Specifications

Switching Regulators & Controllers LP3907SQ-TJXIP/NOPB attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES IN PFM CONTROL TECHNIQUE, ALSO AVAILABLE VOUT = 3.3V

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.8 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

4

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1 A

Maximum Output Voltage:

3.5 V

Minimum Output Voltage:

.8 V

Nominal Output Voltage:

1.2 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

2100 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LP3907SQ-TJXIP/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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