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LP3906SQ-TKXII/NOPB

Texas Instruments

LP3906SQ-TKXII/NOPB by Texas Instruments

LP3906SQ-TKXII/NOPB by Texas Instruments is a switching regulator with 1.5A output current, operating at 2MHz frequency. Ideal for industrial applications, it supports input voltage range of 2.7V to 5.5V and operates b/w -40°C to 85°C temperature range in a compact chip carrier package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,969 parts In-Stock

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4,969

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Anansix

USA . 2,262 parts In-Stock

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2,262

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Vyrian

USA . 1,912 parts In-Stock

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1,912

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,550 parts In-Stock

1+ parts

$0.500

100+ parts

-

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1,550

$0.500

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AZTECH Wire

Italy . 230 parts In-Stock

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$11.040

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230

$11.040

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Parana Technologies

USA . 354 parts In-Stock

1+ parts

$13.771

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$14.259

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354

$13.771

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$14.259

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IDEA Electronic Components Group

UK . 1,014 parts In-Stock

1+ parts

$15.473

100+ parts

$14.699

1k+ parts

$13.926

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-

1,014

$15.473

$14.699

$13.926

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ChromeModa Solutions

Germany . 323 parts In-Stock

1+ parts

$15.473

100+ parts

$12.688

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323

$15.473

$12.688

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Corphita

USA . 2,766 parts In-Stock

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2,766

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DigiPath Technology Company

USA . 1,042 parts In-Stock

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$13.950

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1,042

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$13.950

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Microchip USA

USA . 310 parts In-Stock

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310

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Overview

Elevate your electronic designs with the LP3906SQ-TKXII/NOPB by Texas Instruments. Crafted with precision and expertise, this switching regulator offers unmatched quality and reliability. Perfect for a wide range of applications, this product provides efficient power management in a compact form factor. Experience the seamless control and superior performance this device brings to your projects. Discover the value and benefits of choosing Texas Instruments for all your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Easy to mount on PCBs for compact and efficient designs.

Package Shape: RECTANGULAR

Standard package shape for easy integration into existing designs.

No. of Terminals: 24

Sufficient terminals for connecting to other components and circuits.

Maximum Operating Temperature: 85 °C

Can operate at higher temperatures without compromising performance.

Control Mode: VOLTAGE-MODE

Provides precise control over output voltage for stability and efficiency.

Minimum Operating Temperature: -40 °C

Can operate in cold environments without any issues.

Terminal Finish: MATTE TIN

Provides a reliable and durable contact surface for terminals.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connection in circuits.

Maximum Output Current: 1.5 A

Capable of delivering high output current for various applications.

Technical Specifications

Switching Regulators & Controllers LP3906SQ-TKXII/NOPB attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO HAS PFM CONTROL TECHNIQUE, ALSO OPERATES AS LDO REGULATOR

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.7 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

R-XQCC-N24

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.5 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16X.2,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

2000 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LP3906SQ-TKXII/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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