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LP3906SQX-FXPI

Texas Instruments

LP3906SQX-FXPI by Texas Instruments

LP3906SQX-FXPI by Texas Instruments is a 24-terminal switching regulator with VOLTAGE-MODE control mode, operating b/w -40 to 85 °C. With BUCK switcher config and PULSE WIDTH MODULATION, it supports input voltage range of 2.7-5.5V for industrial applications at a max frequency of 2000 kHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,991 parts In-Stock

1+ parts

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3,991

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Anansix

USA . 2,033 parts In-Stock

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2,033

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Digiode

USA . 1,273 parts In-Stock

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1,273

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 765 parts In-Stock

1+ parts

$5.500

100+ parts

-

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765

$5.500

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Parana Technologies

USA . 1,312 parts In-Stock

1+ parts

$8.922

100+ parts

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$9.594

10k+ parts

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1,312

$8.922

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$9.594

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DigiPath Technology Company

USA . 324 parts In-Stock

1+ parts

$9.824

100+ parts

$9.039

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324

$9.824

$9.039

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ChromeModa Solutions

Germany . 1,653 parts In-Stock

1+ parts

$10.025

100+ parts

$8.220

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1,653

$10.025

$8.220

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IDEA Electronic Components Group

UK . 1,579 parts In-Stock

1+ parts

$10.025

100+ parts

$9.524

1k+ parts

$9.022

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1,579

$10.025

$9.524

$9.022

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AZTECH Wire

Italy . 824 parts In-Stock

1+ parts

$16.692

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824

$16.692

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Corphita

USA . 910 parts In-Stock

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910

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Overview

Elevate your power management solutions with the LP3906SQX-FXPI by Texas Instruments. This switching regulator boasts top-notch quality from a trusted manufacturer, making it a reliable choice for various applications. With its compact size and efficient performance, this product offers unmatched value and benefits to customers seeking optimal power control. Upgrade your system with the LP3906SQX-FXPI and experience the advantages of advanced technology in power management.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular package shape is common and ensures compatibility with standard PCB layouts and mounting configurations.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes this product suitable for industrial applications where extended temperature ranges are required.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers precise regulation of output voltage, ensuring stability and efficiency in various load conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and reliability for long-term use in electronic circuits.

Nominal Input Voltage: 3.6 V

Optimal nominal input voltage of 3.6V ensures compatibility with a wide range of power sources and battery configurations.

Nominal Output Voltage: 1 V

Stable output voltage of 1V is suitable for powering various electronic components with efficiency and reliability.

Technical Specifications

Switching Regulators & Controllers LP3906SQX-FXPI attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO HAS CONTROL TECHNIQUE OF PFM, ALSO OPERATES AS LDO REGULATOR

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.7 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

R-XQCC-N24

JESD-609 Code:

e0

Length:

5 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage:

1 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

2000 kHz

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

4 mm

Trade Compliance

LP3906SQX-FXPI Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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