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LP2967ITP-1825/NOPB

Texas Instruments

LP2967ITP-1825/NOPB by Texas Instruments

LP2967ITP-1825/NOPB by Texas Instruments is a fixed positive multiple output LDO regulator with 2 outputs. It has a max dropout voltage of 0.425 V, operating temperature range from -40 to 125 °C, and a package style of grid array with very thin profile. Ideal for applications requiring precise voltage regulation in compact electronic devices.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 5,840 parts In-Stock

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Digiode

USA . 5,114 parts In-Stock

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Anansix

USA . 2,703 parts In-Stock

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2,703

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AZTECH Wire

Italy . 226 parts In-Stock

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$4.935

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$4.935

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Parana Technologies

USA . 1,929 parts In-Stock

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$5.182

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$5.783

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1,929

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DigiPath Technology Company

USA . 157 parts In-Stock

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$5.706

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$5.249

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157

$5.706

$5.249

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ChromeModa Solutions

Germany . 1,440 parts In-Stock

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$5.822

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$4.774

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$5.822

$4.774

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IDEA Electronic Components Group

UK . 359 parts In-Stock

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$5.822

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$5.240

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359

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One Stop Electronics

USA . 354 parts In-Stock

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$20.500

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Microchip USA

USA . 4,900 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,743 parts In-Stock

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Corphita

USA . 1,503 parts In-Stock

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Overview

Power up your projects with the LP2967ITP-1825/NOPB by Texas Instruments, a top-quality fixed regulator that guarantees reliable performance. Manufactured by the industry leader in semiconductor technology, this multiple output LDO regulator is perfect for a wide range of applications. With precise voltage regulation and high efficiency, this product offers customers exceptional value and peace of mind. Say goodbye to power issues and hello to seamless operation with the LP2967ITP-1825/NOPB!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the regulator, ensuring a longer lifespan for the product.

Maximum Dropout Voltage-2: 2.425 V

With a high maximum dropout voltage, this regulator can maintain a stable output even when the input voltage drops to a low level.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Operating Temperature (TJ-Max): 125 °C

With a high maximum operating temperature, this regulator can withstand extreme environmental conditions, making it suitable for various applications.

Minimum Output Voltage-2: 2.425 V

This minimum output voltage ensures that the regulator can effectively provide a stable and reliable power supply to connected devices.

Nominal Output Voltage-2: 2.5 V

The nominal output voltage of 2.5V is ideal for powering certain electronic components that require a specific voltage level for optimal performance.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on a circuit board, enabling a compact and streamlined design.

Terminal Form: BALL

The ball terminal form provides a reliable connection between the regulator and the circuit board, ensuring secure and stable operation.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LP2967ITP-1825/NOPB attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Texas Instruments

Specs

Maximum Dropout Voltage-1:

.425 V

Maximum Dropout Voltage-2:

.425 V

Maximum Input Voltage:

16 V

Minimum Input Voltage:

2.8 V

JESD-30 Code:

R-PBGA-B8

JESD-609 Code:

e1

Length:

1.946 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

1.854 V

Minimum Output Voltage-1:

1.746 V

Nominal Output Voltage-1:

1.8 V

Maximum Output Voltage-2:

2.575 V

Minimum Output Voltage-2:

2.425 V

Nominal Output Voltage-2:

2.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

3 %

Width:

1.412 mm

Trade Compliance

LP2967ITP-1825/NOPB Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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