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LP2967IMMX-2533

Texas Instruments

LP2967IMMX-2533 by Texas Instruments

LP2967IMMX-2533 by Texas Instruments is a Fixed Positive Multiple Output LDO Regulator with 2 outputs. It offers a Max Dropout Voltage of 0.425 V, operating at temperatures from -40 to 125°C. Ideal for applications requiring precise voltage regulation in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,864 parts In-Stock

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3,864

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Vyrian

USA . 3,755 parts In-Stock

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3,755

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Anansix

USA . 610 parts In-Stock

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610

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,418 parts In-Stock

1+ parts

$5.219

100+ parts

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$5.831

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1,418

$5.219

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$5.831

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DigiPath Technology Company

USA . 1,204 parts In-Stock

1+ parts

$5.747

100+ parts

$5.287

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1,204

$5.747

$5.287

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ChromeModa Solutions

Germany . 1,732 parts In-Stock

1+ parts

$5.864

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$4.808

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1,732

$5.864

$4.808

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IDEA Electronic Components Group

UK . 909 parts In-Stock

1+ parts

$5.864

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$5.278

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909

$5.864

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$5.278

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AZTECH Wire

Italy . 806 parts In-Stock

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$16.696

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806

$16.696

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One Stop Electronics

USA . 563 parts In-Stock

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$17.500

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$17.500

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Corphita

USA . 1,664 parts In-Stock

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1,664

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Overview

When it comes to reliable power management solutions, look no further than the LP2967IMMX-2533 by Texas Instruments. Crafted with precision and quality in mind, this fixed positive multiple output LDO regulator offers unparalleled performance for a variety of applications. From maintaining stable voltages to ensuring efficient power delivery, this regulator excels at providing the reliability and consistency you need. Trust Texas Instruments to deliver cutting-edge technology that powers your devices seamlessly. Elevate your projects with the LP2967IMMX-2533 and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and offers good protection to the internal components of the regulator, ensuring longevity and reliability.

Maximum Dropout Voltage-2: 2.425 V

Low dropout voltage ensures efficient regulation even when the input voltage is close to the output voltage, leading to better performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Operating Temperature (TJ-Max): 125 °C

The high maximum operating temperature range ensures the regulator can function in a variety of environments without overheating.

Nominal Output Voltage-2: 3.3 V

Stable and accurate output voltage of 3.3 V ensures compatibility with a wide range of devices that require this specific voltage.

No. of Outputs: 2

Having multiple outputs allows for flexibility in powering different components or circuits within a system efficiently.

Maximum Input Voltage: 16 V

High maximum input voltage tolerance provides versatility in various applications where the input voltage may fluctuate or exceed typical levels.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LP2967IMMX-2533 attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Texas Instruments

Specs

Maximum Dropout Voltage-1:

.425 V

Maximum Dropout Voltage-2:

.425 V

Maximum Input Voltage:

16 V

Minimum Input Voltage:

3.5 V

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

2.575 V

Minimum Output Voltage-1:

2.425 V

Nominal Output Voltage-1:

2.5 V

Maximum Output Voltage-2:

3.399 V

Minimum Output Voltage-2:

3.201 V

Nominal Output Voltage-2:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.09 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

3 %

Width:

3 mm

Trade Compliance

LP2967IMMX-2533 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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