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LMX2354TMX

Texas Instruments

LMX2354TMX by Texas Instruments

LMX2354TMX by Texas Instruments is a PLL frequency synthesizer with 24 terminals, operating at 3V supply voltage. It features a small outline package with a max temperature of 85°C, suitable for industrial applications requiring precise frequency synthesis and phase-locked loops. The IC utilizes BiCMOS technology and has a compact form factor of 7.8mm x 4.4mm, making it ideal for surface mount designs in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,741 parts In-Stock

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7,741

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Digiode

USA . 4,348 parts In-Stock

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4,348

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Anansix

USA . 2,874 parts In-Stock

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2,874

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 702 parts In-Stock

1+ parts

$5.500

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702

$5.500

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AZTECH Wire

Italy . 273 parts In-Stock

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$5.809

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273

$5.809

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Parana Technologies

USA . 2,205 parts In-Stock

1+ parts

$21.414

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$21.764

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2,205

$21.414

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$21.764

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DigiPath Technology Company

USA . 1,079 parts In-Stock

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$23.580

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1,079

$23.580

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IDEA Electronic Components Group

UK . 1,727 parts In-Stock

1+ parts

$24.061

100+ parts

$22.858

1k+ parts

$21.655

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1,727

$24.061

$22.858

$21.655

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ChromeModa Solutions

Germany . 1,030 parts In-Stock

1+ parts

$24.061

100+ parts

$19.730

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1,030

$24.061

$19.730

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Corphita

USA . 1,753 parts In-Stock

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1,753

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Overview

Unlock precision frequency control with the LMX2354TMX by Texas Instruments. Crafted with high-quality materials and cutting-edge technology, this Phase Locked Loop (PLL) & Frequency Synthesis Circuit offers unmatched performance in a compact package. Ideal for industrial applications, this versatile component operates flawlessly even in extreme temperatures. Experience seamless integration, superior reliability, and unparalleled value with the LMX2354TMX - the ultimate solution for your frequency synthesis needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the PLL & Frequency Synthesis Circuit, ensuring a longer lifespan.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3 V

The 3V supply voltage allows for compatibility with a wide range of electronic devices, making this product versatile.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this PLL & Frequency Synthesis Circuit can function reliably even in challenging environments.

Technology: BICMOS

The use of BiCMOS technology ensures a good balance of speed and power efficiency in the operation of this circuit, making it a reliable choice for various applications.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2354TMX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Additional Features:

SELECTABLE PRESCALER OF 16/17 OR 20/21 AND 8/9 OR 12/13

Other IC type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

8.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

4.4 mm

Trade Compliance

LMX2354TMX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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