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74HC4046AN

NXP Semiconductors

74HC4046AN by NXP Semiconductors

NXP Semiconductors' 74HC4046AN is a PLL frequency synthesizer IC with 16 terminals. It operates at supply voltages b/w 3V to 6V, suitable for automotive applications. The CMOS technology chip has a temperature range of -40°C to 125°C and comes in a rectangular plastic/epoxy package.

Median Price

$0.636

Lifecycle Status

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Overview

Unlock the power of precision frequency control with the 74HC4046AN by NXP Semiconductors. Crafted with excellence, this Phase Locked Loop (PLL) & Frequency Synthesis Circuit offers unparalleled reliability and performance. Ideal for automotive applications, this compact and versatile component provides customers with a seamless solution for maintaining stable frequencies in their designs. Embrace the benefits of superior quality and innovation with the 74HC4046AN - your key to seamless frequency synthesis.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, making it suitable for various applications.

Nominal Supply Voltage (Vsup): 5 V

The specified supply voltage ensures compatibility with a wide range of systems and power sources, making it versatile for different scenarios.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environments and prolonged use without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of high-quality terminal finish enhances conductivity and resistance to corrosion, ensuring reliable connections for optimal functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient operation and stable performance of the product.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits 74HC4046AN attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from NXP Semiconductors

Specs

Additional Features:

WITH THREE PHASE COMPARATORS

Other IC type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.09 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

4.06 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

74HC4046AN Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-14-472-0442, 5962144720442

NIIN

144720442

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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