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LMX2331LSLBX

Texas Instruments

LMX2331LSLBX by Texas Instruments

LMX2331LSLBX by Texas Instruments is a PLL frequency synthesizer with 24 terminals in a chip carrier package. Operating temperature range of -40 to 85°C, BICMOS technology, and low supply current of 5.4mA make it ideal for industrial applications requiring precise frequency synthesis.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,783 parts In-Stock

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5,783

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Digiode

USA . 4,875 parts In-Stock

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4,875

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Anansix

USA . 2,517 parts In-Stock

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2,517

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ECAB

Sweden . 400 parts In-Stock

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400

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Distributors (Availability)

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One Stop Electronics

USA . 489 parts In-Stock

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$0.500

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489

$0.500

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AZTECH Wire

Italy . 246 parts In-Stock

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$7.193

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246

$7.193

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Parana Technologies

USA . 320 parts In-Stock

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$21.898

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$22.392

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320

$21.898

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$22.392

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DigiPath Technology Company

USA . 2,165 parts In-Stock

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$24.113

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$22.184

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2,165

$24.113

$22.184

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ChromeModa Solutions

Germany . 2,687 parts In-Stock

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$24.605

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$20.176

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IDEA Electronic Components Group

UK . 1,970 parts In-Stock

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$24.605

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$23.375

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$22.144

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1,970

$24.605

$23.375

$22.144

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A-Z Elektronik GmbH

Germany . 9,233 parts In-Stock

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Lixinc

USA . 7,756 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,338 parts In-Stock

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Corphita

USA . 2,650 parts In-Stock

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Assy Fe

Spain . 2,200 parts In-Stock

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Overview

Unlock the power of precise frequency synthesis with the LMX2331LSLBX by Texas Instruments. Manufactured to the highest standards, this Phase Locked Loop (PLL) device offers unparalleled performance and reliability. Perfect for industrial applications, this PLL frequency synthesizer is designed to operate flawlessly in demanding environments, providing customers with a solution they can trust. Experience the value of superior technology and innovation with the LMX2331LSLBX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides strong and durable packaging for the chip carrier, ensuring reliability in various operating conditions.

Surface Mount: YES

Easier and more efficient assembly onto circuit boards, saving time and effort.

Power Supplies (V): 3/5

Supports a wide range of power supply voltages, adding flexibility for different applications.

No. of Terminals: 24

Offers multiple connection points for versatile integration into different circuits.

Package Style (Meter): CHIP CARRIER

Chip carrier style enhances heat dissipation and protects the internal components of the product.

Maximum Operating Temperature: 85 °C

Allows for reliable performance in moderate to high-temperature environments.

Minimum Operating Temperature: -40 °C

Enables the product to operate effectively in cold climates or conditions.

Terminal Position: QUAD

Quad terminal position facilitates easy connections and enhances stability in the circuit.

Other IC type: PLL FREQUENCY SYNTHESIZER

PLL frequency synthesizer ensures precise and stable frequency generation for various applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating makes this product suitable for rugged industrial environments.

Maximum Supply Current (Isup): 5.4 mA

Low maximum supply current consumption for efficient power usage.

Technology: BICMOS

Utilizes advanced BiCMOS technology for enhanced performance and efficiency.

Terminal Form: NO LEAD

Lead-free terminal form for compliance with environmental regulations and RoHS standards.

Terminal Pitch: 0.5 mm

Compact terminal pitch for efficient board space utilization and high-density integration.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits LMX2331LSLBX attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.17X.14,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Current (Isup):

5.4 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LMX2331LSLBX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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