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LMK04368MPAPTEP

Texas Instruments

LMK04368MPAPTEP by Texas Instruments

LMK04368MPAPTEP clock generator by Texas Instruments operates at a max output frequency of 3255 MHz. It features a package style of flatpack, heat sink/slug, thin profile, and fine pitch. This peripheral IC type jitter attenuator is suitable for applications requiring precise timing control in electronic systems.

Median Price

$759.825

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 811 parts In-Stock

1+ parts

$582.320

100+ parts

$527.100

1k+ parts

$502.000

10k+ parts

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811

$582.320

$527.100

$502.000

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Mouser Electronics

USA . 164 parts In-Stock

1+ parts

$937.330

100+ parts

-

1k+ parts

-

10k+ parts

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164

$937.330

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-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 903 parts In-Stock

1+ parts

$553.204

100+ parts

-

1k+ parts

-

10k+ parts

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903

$553.204

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Vyrian

USA . 2,691 parts In-Stock

1+ parts

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10k+ parts

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2,691

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 118 parts In-Stock

1+ parts

$494.970

100+ parts

-

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-

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118

$494.970

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Semicontronic

India . 88 parts In-Stock

1+ parts

$494.970

100+ parts

$482.596

1k+ parts

$480.121

10k+ parts

-

88

$494.970

$482.596

$480.121

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Corphita

USA . 4,604 parts In-Stock

1+ parts

$524.088

100+ parts

-

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10k+ parts

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4,604

$524.088

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Corohmni

South Africa . 69 parts In-Stock

1+ parts

$582.320

100+ parts

-

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10k+ parts

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69

$582.320

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Overview

Enhance your electronic designs with the LMK04368MPAPTEP by Texas Instruments, a top-quality clock generator that offers precision and reliability. Manufactured by a trusted industry leader, this versatile component is perfect for a wide range of applications. With its advanced technology and high-performance capabilities, this clock generator provides exceptional value and benefits to customers looking to elevate their projects. Upgrade your designs today with the LMK04368MPAPTEP and experience unparalleled performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

The surface mount capability allows for easy installation on printed circuit boards, saving space and enabling efficient production processes.

Maximum Supply Voltage: 3.465 V

With a high maximum supply voltage, the clock generator can handle power fluctuations without risking damage to the device.

Package Shape: SQUARE

The square package shape facilitates easier handling and placement within electronic systems, optimizing space utilization.

Maximum Output Clock Frequency: 3255 MHz

The high maximum output clock frequency ensures that the clock generator can support high-speed data processing and communication requirements.

No. of Terminals: 64

The large number of terminals allows for versatile connectivity options, enabling the clock generator to interface with multiple components in a system.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The various package styles offer flexibility in mounting and cooling options, catering to different design requirements and thermal management needs.

Minimum Supply Voltage: 3.135 V

The low minimum supply voltage ensures energy efficiency and helps in reducing power consumption during operation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range allows the clock generator to function reliably in harsh environmental conditions without overheating.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the clock generator can operate effectively even in extremely cold environments.

Terminal Position: QUAD

The quad terminal positioning simplifies connections and enhances signal integrity, making the clock generator suitable for high-performance applications.

Maximum Seated Height: 1.2 mm

The low maximum seated height enables the clock generator to be installed in compact spaces without causing interference with other components.

Width: 10 mm

The compact width dimension allows for efficient utilization of PCB real estate, making it easier to integrate the clock generator into existing designs.

Length: 10 mm

The compact length dimension further contributes to space-saving benefits, ensuring the clock generator can fit into tight layout constraints.

Peripheral IC Type: JITTER ATTENUATOR

The use of a jitter attenuator as the peripheral IC type helps in reducing signal distortion and improving overall clock stability and accuracy.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing the efficiency and reliability of the clock generator.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections and robust mechanical support, ensuring reliable performance in demanding operating conditions.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage matches standard power requirements, ensuring compatibility with most electronic systems and consistent performance.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for dense packing of components on the PCB, enhancing signal integrity and reducing interference in high-frequency applications.

Nominal Primary Clock/Crystal Frequency: 6400 MHz

The high nominal primary clock/crystal frequency supports advanced processing speeds and data transmission rates, making the clock generator suitable for demanding applications.

Technical Specifications

Clock Generators LMK04368MPAPTEP attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Clock Frequency:

3255 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HTQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Nominal Primary Clock/Crystal Frequency:

6400 MHz

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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