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LMH6718MA

Texas Instruments

LMH6718MA by Texas Instruments

LMH6718MA by Texas Instruments is a buffer amplifier with 130 MHz bandwidth, 250 V/us slew rate, and 20 uA max average bias current. It is ideal for high-speed signal buffering in applications requiring precise voltage control and low input offset voltage. The small outline package with gull wing terminals makes it suitable for surface mount designs in compact electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,829 parts In-Stock

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Digiode

USA . 3,601 parts In-Stock

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Anansix

USA . 307 parts In-Stock

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Ack Elektronik San.Tic.Ltd.Sti

. 94 parts In-Stock

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Semi Source

USA . 3 parts In-Stock

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One Stop Electronics

USA . 1,344 parts In-Stock

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$5.410

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$5.410

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Parana Technologies

USA . 947 parts In-Stock

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$6.569

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$610.040

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$5.912

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947

$6.569

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DigiPath Technology Company

USA . 1,530 parts In-Stock

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$7.233

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$6.655

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$7.233

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ChromeModa Solutions

Germany . 3,370 parts In-Stock

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$7.381

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$6.052

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IDEA Electronic Components Group

UK . 1,018 parts In-Stock

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$7.381

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$6.643

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AZTECH Wire

Italy . 546 parts In-Stock

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$18.677

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Component Stockers USA

USA . 285 parts In-Stock

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$99.990

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Alle Elektronik GmbH

Germany . 3,705 parts In-Stock

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Corphita

USA . 2,599 parts In-Stock

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Overview

Elevate your electronic designs with the LMH6718MA buffer amplifier by Texas Instruments. Crafted with precision and quality, this dual-function amplifier offers unparalleled performance and reliability. Ideal for a wide range of applications, from audio equipment to industrial machinery, this small-outline package delivers a nominal bandwidth of 130 MHz with a minimum slew rate of 250 V/us. With a nominal supply voltage of 5V and a low bias current of 20uA, the LMH6718MA ensures optimal functionality while maximizing efficiency. Upgrade your projects today with this innovative and versatile buffer amplifier from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Maximum Input Offset Voltage: 15000 uV

Low offset voltage ensures minimal error in the output signal, making this buffer amplifier ideal for precision applications.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with a wide range of systems.

No. of Terminals: 8

Provides versatility in connections and compatibility with various circuit designs.

Nominal Bandwidth (3dB): 130 MHz

High bandwidth allows for fast signal processing and amplification, making it suitable for high-frequency applications.

Amplifier Type: BUFFER

As a buffer amplifier, it provides impedance matching and signal isolation, ensuring signal integrity and preventing load effects.

Technical Specifications

Buffer Amplifiers LMH6718MA attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

2

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

130 MHz

Minimum Slew Rate:

250 V/us

Nominal Slew Rate:

400 V/us

Input Offset Voltage Limit:

15 mV

Peak Bias Current:

20 uA

Maximum Bias Current (IIB) @25 °C:

15 uA

Operational Characteristics

Maximum Supply Current:

6.2 mA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6.75 V

Nominal Negative Supply Voltage (Vsup):

-5 V

Maximum Negative Supply Voltage:

-6.75 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.193 in (4.902 mm)

Width:

0.154 in (3.899 mm)

Maximum Seated Height:

0.069 in (1.753 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Style:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Packing Method:

Rails

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

LMH6718MA Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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