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LMD18201MWC

Texas Instruments

LMD18201MWC by Texas Instruments

LMD18201MWC by Texas Instruments is a HB-based peripheral driver with PWM, featuring a max supply voltage of 55V and nominal output peak current limit of 6A. This surface-mount chip offers built-in protections against transient, overcurrent, thermal, and undervoltage conditions. Ideal for applications requiring high-power motor control in robotics or automation systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,327 parts In-Stock

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4,327

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Vyrian

USA . 4,040 parts In-Stock

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4,040

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Anansix

USA . 1,451 parts In-Stock

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1,451

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,610 parts In-Stock

1+ parts

$4.130

100+ parts

-

1k+ parts

$4.579

10k+ parts

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1,610

$4.130

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$4.579

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DigiPath Technology Company

USA . 1,662 parts In-Stock

1+ parts

$4.547

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1,662

$4.547

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ChromeModa Solutions

Germany . 1,369 parts In-Stock

1+ parts

$4.640

100+ parts

$3.805

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1,369

$4.640

$3.805

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IDEA Electronic Components Group

UK . 286 parts In-Stock

1+ parts

$4.640

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$4.176

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286

$4.640

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$4.176

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One Stop Electronics

USA . 1,602 parts In-Stock

1+ parts

$9.500

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1,602

$9.500

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AZTECH Wire

Italy . 298 parts In-Stock

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$18.142

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298

$18.142

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Corphita

USA . 1,497 parts In-Stock

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1,497

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Overview

Discover the ultimate solution for driving your peripherals with the Texas Instruments LMD18201MWC. This high-quality peripheral driver offers built-in protections against transient, over current, thermal, and under voltage issues, providing peace of mind for your projects. With a maximum supply voltage of 55 V and a nominal output peak current limit of 6 A, this chip is perfect for a wide range of applications. Trust in Texas Instruments' reputation for reliability and innovation, and experience the value and benefits that the LMD18201MWC can bring to your designs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 55V

High maximum supply voltage of 55V provides flexibility in power supply options and enables compatibility with a wide range of applications.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Multiple built-in protections enhance the reliability and safety of the peripheral driver, protecting it from various potential risks and improving longevity.

Package Style (Meter): UNCASED CHIP

The unencased chip package style offers a compact and lightweight design, making it suitable for small-scale applications and reducing overall product size.

Minimum Supply Voltage: 12V

Low minimum supply voltage of 12V provides flexibility in power input options and ensures compatibility with a wide range of power sources.

Terminal Position: UPPER

Upper terminal position simplifies connections and facilitates integration into existing circuit designs, improving overall ease of use.

Technology: BCDMOS

BCDMOS technology offers a balance of performance and efficiency, making the peripheral driver suitable for various applications requiring both high speed and low power consumption.

Terminal Form: NO LEAD

No lead terminal form helps in reducing the risk of short circuits and improving overall reliability, especially in high-voltage applications.

Nominal Supply Voltage: 42V

Nominal supply voltage of 42V offers a common power input option for many applications, ensuring compatibility with standard power sources.

Nominal Output Peak Current Limit: 6A

High nominal output peak current limit of 6A allows for driving high-power loads with ease, making it suitable for applications requiring substantial current handling capacity.

Interface IC Type: HB BASED PERIPHERAL DRIVER WITH PWM

HB based peripheral driver with PWM interface IC type offers advanced control options, enabling precise modulation of output signals for optimal performance.

Output Current Flow Direction: SOURCE AND SINK

Source and sink output current flow direction allows for bidirectional current control, making the peripheral driver versatile and suitable for a wide range of load types.

Technical Specifications

Peripheral Drivers LMD18201MWC attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

6 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage:

55 V

Minimum Supply Voltage:

12 V

Nominal Supply Voltage:

42 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

LMD18201MWC Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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