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LMD18200MWC

Texas Instruments

LMD18200MWC by Texas Instruments

LMD18200MWC by Texas Instruments is a HB-based peripheral driver with PWM, featuring a max supply voltage of 55V and nominal output peak current limit of 6A. With built-in protections against transient, overcurrent, thermal, and undervoltage conditions, it is ideal for automotive applications requiring a robust surface-mount solution.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,336 parts In-Stock

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6,336

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Digiode

USA . 3,743 parts In-Stock

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3,743

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Anansix

USA . 526 parts In-Stock

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526

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,711 parts In-Stock

1+ parts

$12.754

100+ parts

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1k+ parts

$13.220

10k+ parts

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1,711

$12.754

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$13.220

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ChromeModa Solutions

Germany . 1,753 parts In-Stock

1+ parts

$14.330

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$11.751

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1,753

$14.330

$11.751

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IDEA Electronic Components Group

UK . 203 parts In-Stock

1+ parts

$14.330

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$13.614

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$12.897

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203

$14.330

$13.614

$12.897

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AZTECH Wire

Italy . 820 parts In-Stock

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$17.097

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820

$17.097

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One Stop Electronics

USA . 211 parts In-Stock

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$22.500

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211

$22.500

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Corphita

USA . 2,935 parts In-Stock

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2,935

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DigiPath Technology Company

USA . 1,344 parts In-Stock

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$12.920

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1,344

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$12.920

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Overview

Enhance the performance of your electronic devices with the Texas Instruments LMD18200MWC peripheral driver. With built-in protections against transient, over current, thermal, and under voltage issues, this surface mount chip offers reliability and peace of mind. Ideal for automotive applications, this HB based peripheral driver with PWM interface seamlessly integrates into various systems to provide a nominal output peak current limit of 6A. Trust Texas Instruments for quality components that deliver superior results every time. Upgrade your technology today with the LMD18200MWC.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and efficient mounting of the peripheral driver onto a circuit board, saving space and improving overall design flexibility.

Maximum Supply Voltage: 55 V

The high maximum supply voltage of 55V provides compatibility with a wide range of electronic systems, making it versatile and suitable for various applications.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and reliability of the peripheral driver by safeguarding it against common electrical issues, enhancing the longevity of the product.

Package Style (Meter): UNCASED CHIP

The unencased chip design offers a compact and lightweight form factor, ideal for space-constrained environments and enabling easy integration into existing electronic setups.

Minimum Supply Voltage: 12 V

The low minimum supply voltage requirement of 12V allows for operation in systems with limited power availability, increasing the product's compatibility and usefulness.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the peripheral driver can withstand demanding thermal environments, ensuring consistent performance under extreme conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C extends the operational range of the peripheral driver, making it suitable for use in diverse environmental settings.

Terminal Position: UPPER

The upper terminal position facilitates easy connectivity and wiring, improving installation efficiency and reducing setup time for the peripheral driver.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures the peripheral driver meets stringent industry standards for reliability and performance, making it an ideal choice for automotive applications.

Technology: BCDMOS

The BCDMOS technology offers a good balance between power efficiency and performance, making the peripheral driver energy-efficient and capable of delivering reliable output signals.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and reduces the risk of solder-related issues, enhancing the overall durability and reliability of the peripheral driver.

Nominal Supply Voltage: 42 V

The nominal supply voltage of 42V strikes a good balance between power requirements and performance, ensuring optimal operation of the peripheral driver in various electronic systems.

Nominal Output Peak Current Limit: 6 A

With a high nominal output peak current limit of 6A, the peripheral driver can drive demanding loads with ease, making it suitable for power-hungry applications.

Interface IC Type: HB BASED PERIPHERAL DRIVER WITH PWM

The interface IC type of HB-based peripheral driver with PWM offers advanced control capabilities, allowing for precise modulation of output signals and enhancing the versatility of the product.

Output Current Flow Direction: SOURCE AND SINK

The ability to both source and sink current provides flexibility in driving various types of loads, making the peripheral driver a versatile solution for diverse electronic applications.

Technical Specifications

Peripheral Drivers LMD18200MWC attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

6 A

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage:

55 V

Minimum Supply Voltage:

12 V

Nominal Supply Voltage:

42 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

LMD18200MWC Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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