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LM96194CIAQX

Texas Instruments

LM96194CIAQX by Texas Instruments

Texas Instruments' LM96194CIAQX is a 48-terminal Power Management IC with 3.3V nominal voltage, suitable for industrial applications. Featuring a square package shape and 0.8mm max seated height, it operates b/w -40 to 85 °C with no-lead terminal form. This IC supports power supply circuits and offers 9 channels for versatile usage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,507 parts In-Stock

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8,507

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Anansix

USA . 2,668 parts In-Stock

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2,668

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Digiode

USA . 2,122 parts In-Stock

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2,122

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Distributors (Availability)

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Parana Technologies

USA . 11 parts In-Stock

1+ parts

$3.912

100+ parts

-

1k+ parts

$4.386

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11

$3.912

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$4.386

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DigiPath Technology Company

USA . 413 parts In-Stock

1+ parts

$4.307

100+ parts

$3.963

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413

$4.307

$3.963

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ChromeModa Solutions

Germany . 5,474 parts In-Stock

1+ parts

$4.395

100+ parts

$3.604

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5,474

$4.395

$3.604

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IDEA Electronic Components Group

UK . 917 parts In-Stock

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$4.395

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$3.956

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917

$4.395

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$3.956

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One Stop Electronics

USA . 649 parts In-Stock

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$5.500

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649

$5.500

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AZTECH Wire

Italy . 258 parts In-Stock

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$7.176

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258

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Corphita

USA . 2,251 parts In-Stock

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Overview

Unlock the power of innovation with Texas Instruments' LM96194CIAQX Power Management IC. Designed for industrial-grade applications, this chip carrier boasts a very thin profile and heat sink/slug package style, ensuring efficient performance at temperatures ranging from -40 to 85°C. With 9 channels and a nominal supply voltage of 3.3V, this surface-mount device offers unparalleled reliability and precision in managing power supplies. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient installation, saving time and effort during manufacturing.

Package Shape: SQUARE

Square package shape provides stability and efficient use of space on a circuit board, making the product versatile and easy to integrate.

Nominal Supply Voltage (Vsup): 3.3 V

3.3V nominal supply voltage is a commonly used standard in many electronic devices, ensuring compatibility and ease of use.

No. of Terminals: 48

With 48 terminals, this product offers versatile connectivity options, allowing for diverse applications and configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

A combination of chip carrier, heat sink/slug, and very thin profile package styles enables efficient heat dissipation, compact design, and improved performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures reliability and performance in harsh environmental conditions.

Terminal Position: QUAD

Quad terminal position offers efficient connectivity and allows for easy and secure connections, enhancing the product's usability.

Maximum Seated Height: 0.8 mm

With a maximum seated height of 0.8mm, this product is slim and compact, enabling space-saving design and ease of integration.

Width (mm): 7 mm

At a width of 7mm, this product is compact and slim, making it suitable for applications where space is limited.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this product enhances the efficiency and stability of power management, ensuring reliable operation.

Minimum Supply Voltage (Vsup): 3 V

With a minimum supply voltage of 3V, this product offers a wide voltage range, accommodating various power sources and requirements.

Length: 7 mm

At a length of 7mm, this product is compact and space-saving, ideal for applications with limited board space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures durability and reliability in demanding industrial environments, making the product suitable for critical applications.

No. of Channels: 9

Having 9 channels allows for multiple outputs and control options, increasing the product's versatility and flexibility in power management.

Terminal Form: NO LEAD

The no-lead terminal form offers easy assembly and soldering, reducing the risk of damage and ensuring reliable connections.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this product provides precise and compact terminal spacing, enabling efficient connectivity and signal integrity.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V supports a wide range of power sources and ensures compatibility with various devices and applications.

Technical Specifications

Power Management ICs LM96194CIAQX attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Channels:

9

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

7 mm

Trade Compliance

LM96194CIAQX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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