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LM96080CIMT

Texas Instruments

LM96080CIMT by Texas Instruments

LM96080CIMT by Texas Instruments is a Power Management IC with 24 terminals, operating b/w -40 to 125°C. It has a supply voltage range of 3-5.5V and is designed for automotive applications. The package style is small outline, shrink pitch, making it suitable for surface mount assembly in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,081 parts In-Stock

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Anansix

USA . 2,828 parts In-Stock

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Digiode

USA . 2,188 parts In-Stock

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Semi Source

USA . 45 parts In-Stock

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Prism Electronics

USA . 38 parts In-Stock

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Parana Technologies

USA . 1,310 parts In-Stock

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$3.462

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$3.985

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DigiPath Technology Company

USA . 1,953 parts In-Stock

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$3.812

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$3.507

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ChromeModa Solutions

Germany . 2,185 parts In-Stock

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$3.890

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$3.190

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IDEA Electronic Components Group

UK . 1,583 parts In-Stock

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$3.890

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$3.501

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AZTECH Wire

Italy . 517 parts In-Stock

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$5.087

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One Stop Electronics

USA . 443 parts In-Stock

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$7.500

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A-Z Elektronik GmbH

Germany . 11,048 parts In-Stock

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Corphita

USA . 4,820 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,699 parts In-Stock

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Kepictronics

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Overview

Enhance your power management solutions with the LM96080CIMT from Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality products that are reliable and efficient. The LM96080CIMT falls under the category of Power Management ICs and is designed to meet the demands of various applications. With its small outline package and wide operating temperature range, this product provides exceptional value and performance for customers seeking dependable power supply management circuits. Trust Texas Instruments to power up your projects with the LM96080CIMT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures a lightweight and durable design, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V nominal supply voltage is commonly used in many consumer electronics and industrial applications, providing compatibility with a wide range of systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environments and ensure reliability in demanding conditions.

Width (mm): 4.4 mm

The compact width of 4.4mm allows for space-efficient design and integration into compact electronic devices.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

This power management IC is specifically designed for efficient power supply management, ensuring optimal performance and energy efficiency in electronic systems.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V provides versatility and compatibility with a wide range of power sources and systems.

Technical Specifications

Power Management ICs LM96080CIMT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

Length:

7.8 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LM96080CIMT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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