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LM6171AIN

Texas Instruments

LM6171AIN by Texas Instruments

LM6171AIN by Texas Instruments is an 8-terminal video amplifier with a nominal bandwidth of 160 kHz. It operates in industrial temperature range (-40 to 85°C) and uses bipolar technology. This rectangular package (9.817mm x 7.62mm x 5.08mm) made of plastic/epoxy is ideal for audio & video applications requiring high-speed signal processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,093 parts In-Stock

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Digiode

USA . 4,276 parts In-Stock

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Anansix

USA . 2,677 parts In-Stock

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Standard Data Resources

USA . 130 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 82 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 30 parts In-Stock

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R&J Components

USA . 10 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 307 parts In-Stock

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$3.550

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$329.691

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$3.195

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307

$3.550

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$3.195

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DigiPath Technology Company

USA . 2,119 parts In-Stock

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$3.909

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$3.596

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ChromeModa Solutions

Germany . 6,560 parts In-Stock

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$3.989

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$3.271

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IDEA Electronic Components Group

UK . 1,098 parts In-Stock

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$3.989

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$3.590

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One Stop Electronics

USA . 1,438 parts In-Stock

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$6.800

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AZTECH Wire

Italy . 777 parts In-Stock

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$15.188

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Alle Elektronik GmbH

Germany . 4,932 parts In-Stock

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Corphita

USA . 4,472 parts In-Stock

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Overview

Elevate your audio and video experience with the LM6171AIN by Texas Instruments. Crafted with precision and expertise, this video amplifier delivers unparalleled quality and performance. Whether you are enhancing your home theater system or optimizing your professional audio setup, this versatile component offers unmatched value and reliability. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations. Elevate your sound and visuals with the LM6171AIN today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and heat resistance, making the product suitable for long-term use in various environments.

Package Shape: RECTANGULAR

Allows for easy installation and integration into different systems or setups.

General IC Type: VIDEO AMPLIFIER

Specifically designed for processing video signals, ensuring high-quality video output.

No. of Terminals: 8

Sufficient number of terminals for connecting with other components or devices.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures without compromising performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature environments, providing versatility in application.

Maximum Seated Height: 5.08 mm

Compact design allows for space-saving installation in tight spaces.

Width: 7.62 mm

Narrow width enables easy placement and arrangement in electronic circuits or systems.

Length: 9.817 mm

Optimal length for fitting into standard electronic setups or configurations.

Technology: BIPOLAR

Utilizes bipolar technology for efficient signal processing and amplification.

Nominal Bandwidth: 160 kHz

Wide bandwidth capability for handling various video signal frequencies effectively.

Terminal Form: THROUGH-HOLE

Enables secure and stable connections with other components through standard mounting methods.

Technical Specifications

Audio & Video Amplifiers LM6171AIN attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

OPERATES WITH 5.5V TO 34 V

Nominal Bandwidth:

160 kHz

General IC Type:

JESD-30 Code:

R-PDIP-T8

Length:

9.817 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.08 mm

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

LM6171AIN General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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