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LM431BIM3XN1C

Texas Instruments

LM431BIM3XN1C by Texas Instruments

LM431BIM3XN1C by Texas Instruments is a voltage reference IC with adjustable output (2.47-2.52V) in a small outline package suitable for industrial applications. It operates b/w -40 to 85°C, has a max temp coefficient of 54.509 ppm/°C, and is ideal for precision voltage regulation in compact electronic devices.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Adafruit Industries

USA . 313 parts In-Stock

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Vyrian

USA . 6,750 parts In-Stock

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6,750

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Digiode

USA . 3,716 parts In-Stock

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Anansix

USA . 1,503 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Parana Technologies

USA . 815 parts In-Stock

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$0.918

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$1.837

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815

$0.918

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$1.837

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DigiPath Technology Company

USA . 1,604 parts In-Stock

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$1.011

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$0.930

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1,604

$1.011

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ChromeModa Solutions

Germany . 4,556 parts In-Stock

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$1.032

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$0.846

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$1.032

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IDEA Electronic Components Group

UK . 322 parts In-Stock

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$1.032

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$0.929

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Aztec Data Supply Inc.

USA . 282 parts In-Stock

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$3.133

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282

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Ampacity Inc.

Singapore . 171 parts In-Stock

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$7.500

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AZTECH Wire

Italy . 864 parts In-Stock

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Metaverse IC Inc.

Canada . 72,348 parts In-Stock

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Continental Prestige Electronics

USA . 6,257 parts In-Stock

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Corphita

USA . 1,733 parts In-Stock

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Argo Parts USA

USA . 974 parts In-Stock

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Advanced Electronics

New Zealand . 313 parts In-Stock

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Robosynatics

Brazil . 250 parts In-Stock

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250

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Lucentia Tech

USA . 250 parts In-Stock

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250

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the LM431BIM3XN1C by Texas Instruments, a leading manufacturer in the industry. This voltage reference is perfect for a wide range of applications, offering precision and stability without compromising on performance. With its trim or adjustable output and small outline package, this product is designed to meet your needs with ease. Trust Texas Instruments to provide you with top-notch products that deliver exceptional value and benefits, making your projects more efficient and effective. Choose the LM431BIM3XN1C for superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring reliability in various operating conditions.

Surface Mount: YES

The surface mount capability allows for easy integration onto PCBs, saving space and simplifying the assembly process.

Trim or Adjustable Output (V): YES

The ability to trim or adjust the output voltage allows for precise calibration and customization according to specific application requirements.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to mount and align within circuit designs, optimizing space utilization.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Nominal Output Voltage: 2.495 V

The precise nominal output voltage provides a stable reference for other circuit components, improving overall system accuracy.

Technical Specifications

Voltage References LM431BIM3XN1C attributes and parameters. Explore more Voltage References devices from Texas Instruments

Specs

Additional Features:

OUTPUT VOLTAGE ADJUSTABLE FROM 2.5 TO 36V WITH TWO EXTERNAL RESISTORS

JESD-30 Code:

R-PDSO-G3

Length:

2.92 mm

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

2.52 V

Minimum Output Voltage:

2.47 V

Nominal Output Voltage:

2.495 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.12 mm

Surface Mount:

YES

Technology:

BIPOLAR

Max Voltage Temp Coef:

54.509 ppm/Cel

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trim or Adjustable Output (V):

YES

Width (mm):

1.3 mm

Trade Compliance

LM431BIM3XN1C Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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