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LM4312SN/NOPB

Texas Instruments

LM4312SN/NOPB by Texas Instruments

LM4312SN/NOPB by Texas Instruments is a Line Driver with 48 terminals, operating at 1.8V supply voltage and 33mA supply current. It has a max temperature of 85°C, suitable for industrial applications requiring high-speed data transmission in compact spaces. The chip carrier package style with matte tin finish makes it ideal for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,677 parts In-Stock

1+ parts

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7,677

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Digiode

USA . 506 parts In-Stock

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506

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Connector Distribution Corp

USA . 100 parts In-Stock

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100

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Right Parts Inc.

USA . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,230 parts In-Stock

1+ parts

$3.305

100+ parts

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$3.826

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2,230

$3.305

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$3.826

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DigiPath Technology Company

USA . 1,145 parts In-Stock

1+ parts

$3.639

100+ parts

$3.348

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1,145

$3.639

$3.348

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ChromeModa Solutions

Germany . 5,697 parts In-Stock

1+ parts

$3.713

100+ parts

$3.045

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5,697

$3.713

$3.045

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IDEA Electronic Components Group

UK . 1,034 parts In-Stock

1+ parts

$3.713

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$3.342

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1,034

$3.713

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$3.342

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AZTECH Wire

Italy . 601 parts In-Stock

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$14.108

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601

$14.108

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One Stop Electronics

USA . 637 parts In-Stock

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$14.500

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637

$14.500

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Perfect Parts

USA . 1,680 parts In-Stock

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1,680

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Corphita

USA . 1,220 parts In-Stock

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Microchip USA

USA . 443 parts In-Stock

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443

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Overview

The LM4312SN/NOPB by Texas Instruments is a high-quality line driver that offers exceptional performance and reliability. Manufactured by a trusted industry leader, this product is designed to meet the demanding requirements of various applications in the electronics industry. With its advanced features and innovative design, the LM4312SN/NOPB provides customers with unmatched value and benefits. Whether you're looking for superior signal integrity, precise data transmission, or efficient power management, this product has got you covered. Upgrade your system today with the LM4312SN/NOPB and experience the difference in performance and quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for use in various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and improving overall system reliability.

Power Supplies (V): 1.8

Operates on a low voltage of 1.8V, making it energy efficient and suitable for low power consumption applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand elevated temperatures and operate reliably in harsh environments.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperatures of up to 260°C, ensuring stable performance during the assembly process.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this product has a moderate level of moisture sensitivity, allowing for safe storage and handling in typical factory conditions.

Technical Specifications

Line Drivers & Receivers LM4312SN/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

33 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LM4312SN/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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