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LM4312SNX/NOPB

Texas Instruments

LM4312SNX/NOPB by Texas Instruments

LM4312SNX/NOPB by Texas Instruments is a Line Driver with 48 terminals, operating at 1.8V supply voltage and 33mA supply current. It has a max temperature of 85°C and is suitable for industrial applications requiring high-speed data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,016 parts In-Stock

1+ parts

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4,016

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Digiode

USA . 3,932 parts In-Stock

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3,932

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 611 parts In-Stock

1+ parts

$7.764

100+ parts

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611

$7.764

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Parana Technologies

USA . 107 parts In-Stock

1+ parts

$9.123

100+ parts

-

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$9.775

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107

$9.123

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$9.775

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DigiPath Technology Company

USA . 613 parts In-Stock

1+ parts

$10.046

100+ parts

-

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613

$10.046

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ChromeModa Solutions

Germany . 5,991 parts In-Stock

1+ parts

$10.251

100+ parts

$8.406

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5,991

$10.251

$8.406

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IDEA Electronic Components Group

UK . 643 parts In-Stock

1+ parts

$10.251

100+ parts

$9.738

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$9.226

10k+ parts

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643

$10.251

$9.738

$9.226

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One Stop Electronics

USA . 678 parts In-Stock

1+ parts

$19.500

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678

$19.500

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Corphita

USA . 2,650 parts In-Stock

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2,650

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Microchip USA

USA . 480 parts In-Stock

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480

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Overview

Get ready to experience top-notch quality and reliability with the LM4312SNX/NOPB by Texas Instruments. As a leader in the industry, Texas Instruments ensures that this line driver offers exceptional performance and durability. From industrial applications to consumer electronics, this product is versatile and efficient, providing value and benefits that exceed expectations. Trust Texas Instruments for all your electronic component needs and elevate your projects with the LM4312SNX/NOPB today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without losing functionality.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures that the product can withstand the soldering process during assembly without damage.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product is resistant to moisture damage, making it suitable for a variety of environments.

Technical Specifications

Line Drivers & Receivers LM4312SNX/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

33 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LM4312SNX/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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