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LM4308SQ

Texas Instruments

LM4308SQ by Texas Instruments

LM4308SQ by Texas Instruments is a Line Driver & Receiver IC with DOT MATRIX display mode and PARALLEL data input. It operates b/w -40 to 85 °C, with 1.6-2 V supply range. Ideal for industrial LCD driver applications due to its compact square package and multiplexed display capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,253 parts In-Stock

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5,253

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Digiode

USA . 2,229 parts In-Stock

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2,229

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Anansix

USA . 2,005 parts In-Stock

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2,005

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First Choice Components Inc.

USA . 18 parts In-Stock

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 214 parts In-Stock

1+ parts

$11.512

100+ parts

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214

$11.512

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Parana Technologies

USA . 548 parts In-Stock

1+ parts

$12.061

100+ parts

-

1k+ parts

$12.469

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548

$12.061

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$12.469

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IDEA Electronic Components Group

UK . 1,595 parts In-Stock

1+ parts

$13.552

100+ parts

$12.874

1k+ parts

$12.197

10k+ parts

-

1,595

$13.552

$12.874

$12.197

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ChromeModa Solutions

Germany . 1,139 parts In-Stock

1+ parts

$13.552

100+ parts

$11.113

1k+ parts

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1,139

$13.552

$11.113

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One Stop Electronics

USA . 196 parts In-Stock

1+ parts

$26.500

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196

$26.500

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Corphita

USA . 4,143 parts In-Stock

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4,143

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DigiPath Technology Company

USA . 1,777 parts In-Stock

1+ parts

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100+ parts

$12.218

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1,777

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$12.218

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Overview

Elevate your display applications with the LM4308SQ by Texas Instruments, a top-of-the-line line driver and receiver designed to deliver unparalleled performance and reliability. With its cutting-edge technology and superior quality, this product is perfect for a wide range of industries. Whether you're in need of dot matrix display solutions or parallel data input capabilities, the LM4308SQ has you covered. Trust in Texas Instruments' reputation for excellence and experience the value and benefits that this product brings to your projects. Upgrade your displays today and see the difference for yourself.

Feature Benefit Bullets

Display Mode: DOT MATRIX

Dot matrix display provides flexibility and versatility in displaying various types of information.

Data Input Mode: PARALLEL

Parallel data input mode allows for faster data transmission, improving overall system performance.

Surface Mount: YES

Surface mount capability makes it easy to integrate into compact electronic devices and saves space on the PCB.

Maximum Supply Voltage: 2 V

Allows for a higher supply voltage, providing more flexibility in power requirements for the product.

Package Shape: SQUARE

Square package shape is easy to work with and provides a stable mounting platform on the PCB.

No. of Terminals: 40

Having 40 terminals allows for more connections and functionalities to be integrated into the product.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures effective heat dissipation, which is crucial for optimal performance and longevity of the product.

Minimum Supply Voltage: 1.6 V

Allows for a lower minimum supply voltage, helping to conserve power and improve energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability under harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for use in various industrial settings.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring durable connections.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connections on the PCB.

Maximum Seated Height: 0.8 mm

Low maximum seated height is beneficial for applications with limited space constraints.

Width: 5 mm

Compact width makes the product suitable for space-constrained designs.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures reliable solder connections during the manufacturing process.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for a robust soldering process in lead-free environments.

Length: 5 mm

Compact length complements the width, making the product ideal for compact designs.

Multiplexed Display Capability: YES

Multiplexed display capability enables efficient utilization of display segments, providing flexibility in displaying content.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in demanding industrial environments.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and improves solder joint reliability.

Nominal Supply Voltage: 1.8 V

Nominal supply voltage provides a balance between performance and energy efficiency.

No. of Segments: 18

Having 18 segments allows for displaying a sufficient amount of information on the screen.

Terminal Pitch: 0.4 mm

Fine terminal pitch enables high-density mounting on the PCB, optimizing space usage.

Interface IC Type: LIQUID CRYSTAL DISPLAY DRIVER

The interface IC type ensures compatibility with liquid crystal display technologies for seamless integration.

Technical Specifications

Line Drivers & Receivers LM4308SQ attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Data Input Mode:

PARALLEL

Display Mode:

DOT MATRIX

Interface IC Type:

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

YES

No. of Functions:

1

No. of Segments:

18

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.6 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Trade Compliance

LM4308SQ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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