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LM3900N/P3

Texas Instruments

LM3900N/P3 by Texas Instruments

LM3900N/P3 by Texas Instruments is a quad operational amplifier with 4 functions, Vsup of 15V, and operating temperature range of 0-70°C. Ideal for voltage-feedback applications, it features bipolar technology in a rectangular plastic/epoxy package with 14 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,533 parts In-Stock

1+ parts

-

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6,533

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-

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Digiode

USA . 2,768 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,768

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 348 parts In-Stock

1+ parts

$1.039

100+ parts

-

1k+ parts

$1.904

10k+ parts

-

348

$1.039

-

$1.904

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DigiPath Technology Company

USA . 1,241 parts In-Stock

1+ parts

$1.144

100+ parts

$1.052

1k+ parts

-

10k+ parts

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1,241

$1.144

$1.052

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ChromeModa Solutions

Germany . 999 parts In-Stock

1+ parts

$1.167

100+ parts

$0.957

1k+ parts

-

10k+ parts

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999

$1.167

$0.957

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IDEA Electronic Components Group

UK . 435 parts In-Stock

1+ parts

$1.167

100+ parts

-

1k+ parts

$1.050

10k+ parts

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435

$1.167

-

$1.050

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One Stop Electronics

USA . 722 parts In-Stock

1+ parts

$1.410

100+ parts

-

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722

$1.410

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AZTECH Wire

Italy . 493 parts In-Stock

1+ parts

$17.546

100+ parts

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493

$17.546

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Corphita

USA . 2,361 parts In-Stock

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2,361

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Overview

Enhance your electronic projects with the LM3900N/P3 by Texas Instruments, a top-quality operational amplifier that offers unmatched performance and reliability. With four functions in one compact package, this versatile component is ideal for a wide range of applications. Whether you're designing audio equipment, control systems, or instrumentation, the LM3900N/P3 delivers exceptional value, efficiency, and precision. Trust Texas Instruments to provide you with the cutting-edge technology you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the operational amplifier easy to handle and long-lasting.

No. of Functions: 4

Having multiple functions in one component reduces the need for additional components, saving space and improving efficiency in circuit design.

Nominal Supply Voltage / Vsup (V): 15

The high supply voltage allows for versatile use in various applications without the need for additional voltage regulation.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this operational amplifier can withstand harsh environmental conditions and ensure reliable performance.

Frequency Compensation: YES

Frequency compensation ensures stability and prevents oscillation, making this operational amplifier suitable for precision applications.

Technology: BIPOLAR

Bipolar technology offers high precision and low noise performance, making this operational amplifier ideal for applications where accuracy is critical.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this component is designed for high gain and precise signal amplification, making it suitable for a wide range of signal processing applications.

Technical Specifications

Operational Amplifiers (Op Amps) LM3900N/P3 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

15 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

No

Operational Characteristics

Nominal Supply Voltage:

15 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Physical Characteristics

Total Terminals:

14

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Standards

JESD-30 Code:

R-PDIP-T14

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style:

In Line

Package Equivalence Code:

DIP14,.3

Trade Compliance

LM3900N/P3 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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