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LM3448MAX/NOPB

Texas Instruments

LM3448MAX/NOPB by Texas Instruments

LM3448MAX/NOPB by Texas Instruments is a LED display driver with 16 terminals and BCDMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 8-12 V. Ideal for automotive applications due to its small outline package style and matte tin terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,859 parts In-Stock

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Digiode

USA . 1,089 parts In-Stock

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1,089

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Chip Stock

USA . 200 parts In-Stock

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200

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Distributors (Availability)

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Parana Technologies

USA . 1,701 parts In-Stock

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$11.403

100+ parts

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$11.824

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$11.403

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$11.824

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One Stop Electronics

USA . 353 parts In-Stock

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$11.500

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353

$11.500

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ChromeModa Solutions

Germany . 4,405 parts In-Stock

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$12.812

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$10.506

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$12.812

$10.506

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IDEA Electronic Components Group

UK . 485 parts In-Stock

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$12.812

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$12.171

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$11.531

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485

$12.812

$12.171

$11.531

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AZTECH Wire

Italy . 606 parts In-Stock

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$13.668

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606

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A-Z Elektronik GmbH

Germany . 5,628 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,752 parts In-Stock

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Corphita

USA . 2,922 parts In-Stock

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DigiPath Technology Company

USA . 804 parts In-Stock

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$11.551

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Microchip USA

USA . 204 parts In-Stock

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Overview

Looking to enhance your LED display experience? Look no further than the LM3448MAX/NOPB by Texas Instruments. This Graphics Display Driver offers top-notch quality and reliability, backed by a trusted manufacturer. With applications in automotive and other industries, this product provides an easy-to-use solution for your LED display needs. Enjoy the benefits of high performance, efficiency, and convenience with the LM3448MAX/NOPB. Upgrade your display technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the display driver lightweight and durable, perfect for applications where weight and durability are important factors.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on printed circuit boards, saving time and enhancing overall product reliability.

Maximum Supply Voltage: 12 V

Supports a maximum supply voltage of 12V, making it compatible with a wide range of power supply systems for versatile application scenarios.

Package Shape: RECTANGULAR

Rectangular shape provides a compact and space-saving design, enabling efficient placement within electronic devices with limited space available.

Power Supplies (V): 8/12

Supports dual power supply options of 8V and 12V, providing flexibility in power management according to different system requirements.

Minimum Operating Temperature: -40 °C

Capable of operating at extremely low temperatures of -40°C, ensuring reliable performance even in harsh environmental conditions or cold climates.

Terminal Finish: MATTE TIN

Matte tin finish on terminals enhances solderability and corrosion resistance, prolonging the lifespan of the display driver for long-term use.

Width: 3.9 mm

Compact width of 3.9mm allows for efficient PCB layout design and integration, ideal for applications where space constraints are a concern.

Technology: BCDMOS

Utilizing BCDMOS technology ensures efficient power consumption and high-speed performance, making it an energy-efficient and reliable choice for display driver ICs.

Technical Specifications

Graphics Display Drivers LM3448MAX/NOPB attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

12 V

Minimum Supply Voltage:

8 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

LM3448MAX/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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