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LM25056PSQX/NOPB

Texas Instruments

LM25056PSQX/NOPB by Texas Instruments

LM25056PSQX/NOPB by Texas Instruments is a Power Management IC with 12V supply, 24 terminals, and -40 to 125°C operating temperature range. It is used in automotive applications for power supply support circuits due to its compact chip carrier package and adjustable threshold feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,705 parts In-Stock

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Digiode

USA . 858 parts In-Stock

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Semicontronic

India . 1,309 parts In-Stock

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$0.500

100+ parts

$0.488

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$0.485

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1,309

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One Stop Electronics

USA . 1,090 parts In-Stock

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$0.500

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$0.500

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Ampacity Inc.

Singapore . 1,182 parts In-Stock

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$2.500

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AZTECH Wire

Italy . 459 parts In-Stock

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Parana Technologies

USA . 1,019 parts In-Stock

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$14.559

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$1,351.989

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$13.103

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$1,351.989

$13.103

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DigiPath Technology Company

USA . 1,479 parts In-Stock

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$16.031

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$14.748

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IDEA Electronic Components Group

UK . 2,363 parts In-Stock

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$16.358

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$15.540

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$14.722

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ChromeModa Solutions

Germany . 2,283 parts In-Stock

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$16.358

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$13.414

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Corphita

USA . 2,313 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 271 parts In-Stock

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Overview

Power up your devices with the LM25056PSQX/NOPB by Texas Instruments, a top-quality Power Management IC designed to optimize efficiency and performance. Manufactured by the reputable Texas Instruments, this product is perfect for a wide range of applications in automotive and industrial settings. With its innovative design and reliable performance, this chip carrier with a very thin profile offers customers exceptional value and benefits, ensuring optimal power supply support without compromising on quality. Upgrade your power management system today with the LM25056PSQX/NOPB and experience the difference.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on a PCB, saving space and making it suitable for compact designs.

Nominal Supply Voltage (Vsup): 12 V

Stable supply voltage of 12V ensures consistent performance and compatibility with various applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for automotive and industrial applications.

Width (mm): 4 mm

Compact width of 4mm allows for efficient use of space on the PCB.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage of 3V enables operation in systems with limited power supply capability.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand reflow soldering for up to 30 seconds, making it easy to integrate into the manufacturing process.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and routing on the PCB.

Adjustable Threshold: YES

The adjustable threshold feature provides flexibility in setting voltage thresholds according to specific application requirements.

Technical Specifications

Power Management ICs LM25056PSQX/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.4 VOLT

Adjustable Threshold:

YES

JESD-30 Code:

R-XQCC-N24

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16X.2,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

2.8 mA

Maximum Supply Voltage (Vsup):

17 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+2.4V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LM25056PSQX/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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