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JM38510/65601BRA

Texas Instruments

JM38510/65601BRA by Texas Instruments

JM38510/65601BRA by Texas Instruments is an 8-bit latch with a 5V supply voltage, 240ns propagation delay, and 125°C max operating temp. Ideal for military applications requiring true output polarity, it features a CMOS technology in a ceramic package with dual terminals.

Median Price

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Lifecycle Status

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16

In-Stock Inventory

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Vyrian

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Digiode

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Quantum Digital Technology

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Eagle Technology Solutions

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Lakeland Logistics Inc

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Bristol Electronics

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Electronic Expediters

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Inland Empire Components Inc.

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Digital Electronic Gebert Verwaltungs UG

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ComSIT Distribution GmbH

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Mentor Electronics Marketing, LLC

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Component Sense

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First Choice Components Inc.

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Parana Technologies

USA . 1,460 parts In-Stock

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ChromeModa Solutions

Germany . 5,631 parts In-Stock

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IDEA Electronic Components Group

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AZTECH Wire

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One Stop Electronics

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DigiPath Technology Company

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A-Plus Industry Inc.

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Overview

Enhance your electronic projects with the JM38510/65601BRA by Texas Instruments. Crafted with superior quality and precision, this latches & flip-flops device offers reliability and performance like no other. Designed for military-grade applications, this product ensures optimal functionality even in extreme conditions. With a true output polarity and positive edge trigger type, customers can trust in seamless operation and accurate results. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the JM38510/65601BRA today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides a durable and reliable housing for the internal components, ensuring long-term performance and protection against environmental factors.

Screening Level: MIL-M-38510 Class B

Indicates that the product has undergone stringent testing and meets high military standards, ensuring high quality and reliability.

Nominal Supply Voltage / Vsup (V): 5

The optimal supply voltage ensures stable operation and performance of the latch or flip-flop.

Propagation Delay (tpd): 240 ns

Low propagation delay ensures fast response times and efficient operation in time-critical applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in harsh environmental conditions or industrial settings.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures precise control and timing of the latch or flip-flop functionality.

Minimum Operating Temperature: -55 °C

Capable of operating at extremely low temperatures, making it suitable for a wide range of applications across different environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it an efficient choice for electronic circuits.

Technical Specifications

Latches & Flip-Flops JM38510/65601BRA attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

DUMMY VAL

Family:

HC/UH

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Length:

24.195 mm

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

21 MHz

Trade Compliance

JM38510/65601BRA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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