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JM38510/65453BSA

Texas Instruments

JM38510/65453BSA by Texas Instruments

BUS DRIVER; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 20; Package Code: DFP; Package Shape: RECTANGULAR;

Median Price

$35.958

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 26 parts In-Stock

1+ parts

$26.490

100+ parts

$25.960

1k+ parts

$25.430

10k+ parts

-

26

$26.490

$25.960

$25.430

-

Verical

USA . 26 parts In-Stock

1+ parts

-

100+ parts

$45.425

1k+ parts

-

10k+ parts

-

26

-

$45.425

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey Marketplace

USA . 26 parts In-Stock

1+ parts

$33.540

100+ parts

-

1k+ parts

-

10k+ parts

-

26

$33.540

-

-

-

Digiode

USA . 235 parts In-Stock

1+ parts

$35.226

100+ parts

-

1k+ parts

-

10k+ parts

-

235

$35.226

-

-

-

Vyrian

USA . 7,018 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,018

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 50 parts In-Stock

1+ parts

$4.232

100+ parts

-

1k+ parts

$4.062

10k+ parts

$4.062

50

$4.232

-

$4.062

$4.062

Parana Technologies

USA . 1,260 parts In-Stock

1+ parts

$12.496

100+ parts

-

1k+ parts

$12.936

10k+ parts

-

1,260

$12.496

-

$12.936

-

AZTECH Wire

Italy . 119 parts In-Stock

1+ parts

$13.410

100+ parts

-

1k+ parts

-

10k+ parts

-

119

$13.410

-

-

-

DigiPath Technology Company

USA . 829 parts In-Stock

1+ parts

$13.760

100+ parts

$12.659

1k+ parts

-

10k+ parts

-

829

$13.760

$12.659

-

-

IDEA Electronic Components Group

UK . 2,199 parts In-Stock

1+ parts

$14.041

100+ parts

$13.339

1k+ parts

$12.637

10k+ parts

-

2,199

$14.041

$13.339

$12.637

-

ChromeModa Solutions

Germany . 324 parts In-Stock

1+ parts

$14.041

100+ parts

$11.514

1k+ parts

-

10k+ parts

-

324

$14.041

$11.514

-

-

Component Stockers USA

USA . 815 parts In-Stock

1+ parts

$32.610

100+ parts

-

1k+ parts

-

10k+ parts

-

815

$32.610

-

-

-

Corphita

USA . 4,396 parts In-Stock

1+ parts

$33.372

100+ parts

-

1k+ parts

-

10k+ parts

-

4,396

$33.372

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$34.942

100+ parts

$31.797

1k+ parts

$28.652

10k+ parts

-

5,000

$34.942

$31.797

$28.652

-

Microchip USA

USA . 2,031 parts In-Stock

1+ parts

$77.350

100+ parts

$76.000

1k+ parts

$75.330

10k+ parts

$74.660

2,031

$77.350

$76.000

$75.330

$74.660

Technical Specifications

Bus Driver & Transceivers JM38510/65453BSA attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-GDFP-F20

JESD-609 Code:

e0

Length:

13.09 mm

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay (tpd):

79 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.92 mm

Trade Compliance

JM38510/65453BSA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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