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JM38510/36101BFA

Texas Instruments

JM38510/36101BFA by Texas Instruments

JM38510/36101BFA by Texas Instruments is a 4-bit latches & flip-flops with 30ns propagation delay, suitable for military applications. It operates at 5V with 45pF load capacitance and features a max frequency of 30MHz. This TTL technology device has a temperature range from -55 to 125°C and comes in a ceramic, glass-sealed package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,997 parts In-Stock

1+ parts

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2,997

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Vyrian

USA . 2,006 parts In-Stock

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-

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2,006

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 600 parts In-Stock

1+ parts

$7.267

100+ parts

-

1k+ parts

$7.768

10k+ parts

-

600

$7.267

-

$7.768

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DigiPath Technology Company

USA . 478 parts In-Stock

1+ parts

$8.002

100+ parts

-

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478

$8.002

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ChromeModa Solutions

Germany . 6,702 parts In-Stock

1+ parts

$8.165

100+ parts

$6.695

1k+ parts

-

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6,702

$8.165

$6.695

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IDEA Electronic Components Group

UK . 2,361 parts In-Stock

1+ parts

$8.165

100+ parts

-

1k+ parts

$7.348

10k+ parts

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2,361

$8.165

-

$7.348

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AZTECH Wire

Italy . 731 parts In-Stock

1+ parts

$10.651

100+ parts

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731

$10.651

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One Stop Electronics

USA . 215 parts In-Stock

1+ parts

$30.000

100+ parts

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215

$30.000

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Microchip USA

USA . 4,523 parts In-Stock

1+ parts

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4,523

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Corphita

USA . 1,294 parts In-Stock

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1,294

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Overview

Enhance your electronic projects with the JM38510/36101BFA by Texas Instruments, a top-of-the-line latches & flip-flops component. Crafted with precision and reliability in mind, Texas Instruments delivers exceptional quality in every product. Perfect for a variety of applications, this versatile component offers unparalleled value and benefits to customers. Elevate your designs with the advanced technology and superior performance of the JM38510/36101BFA, setting you apart from the competition.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material ensures durability and protection for the internal components of the latch, making it suitable for long-term use in various environments.

Propagation Delay At Nominal Supply: 30 ns

The low propagation delay allows for quick response times, making this latch ideal for applications requiring high-speed operations.

Surface Mount: YES

Being surface mountable simplifies the installation process and saves space on the PCB, making it a convenient choice for compact electronic designs.

No. of Bits: 4

The 4-bit configuration provides sufficient functionality for basic digital operations, making it suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V ensures compatibility with standard power sources, making integration easier in existing systems.

Technical Specifications

Latches & Flip-Flops JM38510/36101BFA attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDFP-F16

JESD-609 Code:

e0

Length:

10.16 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

30000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

24 mA

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

35 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

6.73 mm

Minimum fmax:

30 MHz

Trade Compliance

JM38510/36101BFA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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