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JM38510/07701BEA

Texas Instruments

JM38510/07701BEA by Texas Instruments

JM38510/07701BEA by Texas Instruments is a MILITARY-grade TTL Decoder & Driver with 16 terminals. It operates at -55 to 125 °C, with a propagation delay of 12 ns. The INVERTED output polarity and standard input conditioning make it ideal for military applications.

Median Price

$42.908

Lifecycle Status

Suppliers In-Stock

21

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1k+

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Rochester

USA . 162 parts In-Stock

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$38.140

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$34.130

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$32.120

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$32.120

Verical

USA . 157 parts In-Stock

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$47.675

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$42.663

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$40.150

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$42.663

$40.150

Distributors (In-Stock)

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Freelance Electronics

USA . 259 parts In-Stock

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$7.190

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$7.549

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$7.118

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Ace Electronics

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Digiode

USA . 1,529 parts In-Stock

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$35.008

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$35.008

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American Microsemiconductor Inc.

USA . 2 parts In-Stock

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$98.520

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Vyrian

USA . 8,819 parts In-Stock

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Electronic Expediters

USA . 1,526 parts In-Stock

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Bristol Electronics

USA . 1,446 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Odi Ramu Company

Canada . 94 parts In-Stock

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Mil-Aero Solutions, Inc.

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Resion

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Electronics Depot

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Manoshevitz Elec. Sales

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Sinequanon

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Microfarads

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Sunrise Surplus Inc.

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First Choice Components Inc.

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R&J Components

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Inland Empire Components Inc.

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AZTECH Wire

Italy . 938 parts In-Stock

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$8.150

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Parana Technologies

USA . 366 parts In-Stock

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$8.750

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$9.433

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DigiPath Technology Company

USA . 1,961 parts In-Stock

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$9.634

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ChromeModa Solutions

Germany . 3,701 parts In-Stock

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$9.831

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IDEA Electronic Components Group

UK . 580 parts In-Stock

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$9.339

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$8.848

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Corphita

USA . 1,567 parts In-Stock

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Microchip USA

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Assy Fe

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Perfect Parts

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Overview

Discover the superior quality and reliability of the JM38510/07701BEA by Texas Instruments, a top-notch Decoder & Driver. With MILITARY-grade screening and a wide temperature range, this product is perfect for demanding applications where precision and durability are essential. Experience fast propagation delay, inverted output polarity, and standard input conditioning in a compact and efficient package. Trust Texas Instruments for cutting-edge technology that delivers exceptional performance and value to meet your needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring long-term reliability.

Input Conditioning: STANDARD

Ensures compatibility with a wide range of input signals, making it versatile for various applications.

Screening Level: MIL-M-38510 Class B

Meets stringent military standards for quality and reliability, making it suitable for critical applications.

Propagation Delay (tpd): 12 ns

Offers fast response times, crucial for high-speed applications where timing is critical.

Temperature Grade: MILITARY

Designed to operate reliably in extreme temperature conditions, suitable for military and aerospace applications.

Technical Specifications

Decoder & Drivers JM38510/07701BEA attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

3 ENABLE INPUTS

Family:

S

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

JM38510/07701BEA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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