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HPA02273ZQLR

Texas Instruments

HPA02273ZQLR by Texas Instruments

Texas Instruments HPA02273ZQLR is a Line Driver & Receiver with 4 functions, operating at 2.8-3.6V. It features a grid array package style, very thin profile, and fine pitch for commercial applications requiring differential output and standard input characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,536

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-

-

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Digiode

USA . 165 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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165

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 874 parts In-Stock

1+ parts

$5.773

100+ parts

-

1k+ parts

-

10k+ parts

-

874

$5.773

-

-

-

Parana Technologies

USA . 693 parts In-Stock

1+ parts

$5.796

100+ parts

-

1k+ parts

$6.585

10k+ parts

-

693

$5.796

-

$6.585

-

DigiPath Technology Company

USA . 77 parts In-Stock

1+ parts

$6.382

100+ parts

-

1k+ parts

-

10k+ parts

-

77

$6.382

-

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ChromeModa Solutions

Germany . 2,250 parts In-Stock

1+ parts

$6.512

100+ parts

$5.340

1k+ parts

-

10k+ parts

-

2,250

$6.512

$5.340

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IDEA Electronic Components Group

UK . 1,172 parts In-Stock

1+ parts

$6.512

100+ parts

-

1k+ parts

$5.861

10k+ parts

-

1,172

$6.512

-

$5.861

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One Stop Electronics

USA . 537 parts In-Stock

1+ parts

$38.500

100+ parts

-

1k+ parts

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10k+ parts

-

537

$38.500

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-

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Corphita

USA . 3,385 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,385

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Overview

Enhance your electronic projects with the HPA02273ZQLR by Texas Instruments, a top-tier manufacturer known for their high-quality line drivers & receivers. With its advanced design and reliable performance, this product is perfect for a wide range of applications. Offering seamless connectivity and efficient data transmission, this component provides exceptional value to customers seeking superior functionality and precision in their projects. Elevate your technology solutions with the HPA02273ZQLR and experience the advantages of cutting-edge innovation in every use.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the line driver & receiver.

Surface Mount: YES

Surface mount capability enables easy and secure installation onto circuit boards, saving space and ensuring stable connections.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6V allows for reliable performance and compatibility with various systems.

No. of Functions: 4

Having 4 functions in one compact unit enhances efficiency and functionality in electronic applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this line driver & receiver can withstand and perform well in elevated temperature environments.

Technical Specifications

Line Drivers & Receivers HPA02273ZQLR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

4

No. of Terminals:

56

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.8 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.5 mm

Trade Compliance

HPA02273ZQLR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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