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HPA00893P

Texas Instruments

HPA00893P by Texas Instruments

HPA00893P by Texas Instruments is a Line Driver & Receiver with 8 terminals, operating at -40 to 85 °C. It features a max supply voltage of 5.25 V, transmit delay of 1300 ns, and differential output. Ideal for industrial applications requiring EIA-485, TIA-485, or ISO 8482 interface standards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,733 parts In-Stock

1+ parts

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5,733

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Digiode

USA . 2,853 parts In-Stock

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2,853

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,203 parts In-Stock

1+ parts

$2.332

100+ parts

-

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$2.831

10k+ parts

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2,203

$2.332

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$2.831

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DigiPath Technology Company

USA . 1,569 parts In-Stock

1+ parts

$2.568

100+ parts

$2.362

1k+ parts

-

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1,569

$2.568

$2.362

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ChromeModa Solutions

Germany . 3,675 parts In-Stock

1+ parts

$2.620

100+ parts

$2.148

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3,675

$2.620

$2.148

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IDEA Electronic Components Group

UK . 1,431 parts In-Stock

1+ parts

$2.620

100+ parts

-

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$2.358

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1,431

$2.620

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$2.358

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AZTECH Wire

Italy . 709 parts In-Stock

1+ parts

$13.295

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709

$13.295

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One Stop Electronics

USA . 312 parts In-Stock

1+ parts

$30.500

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312

$30.500

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Component Stockers USA

USA . 513 parts In-Stock

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$99.990

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513

$99.990

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Corphita

USA . 4,688 parts In-Stock

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4,688

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Microchip USA

USA . 1,209 parts In-Stock

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1,209

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Overview

Enhance your communication systems with the HPA00893P by Texas Instruments, a high-quality line driver and receiver designed to deliver reliable performance in industrial applications. With its durable plastic/epoxy construction and advanced technology, this product offers customers unmatched value and benefits. Whether you're looking to improve data transmission speed or enhance signal integrity, the HPA00893P is the perfect solution for your needs. Upgrade your systems today and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to harsh environments, making the product suitable for various applications.

Maximum Supply Voltage: 5.25 V

Allows for stable and reliable operation within a specified voltage range.

Package Shape: RECTANGULAR

Facilitates easy integration into existing circuit designs and layouts.

Maximum Transmit Delay: 1300 ns

Ensures fast data transmission, ideal for time-sensitive applications.

No. of Terminals: 8

Provides sufficient connectivity options for interfacing with multiple devices or systems.

Minimum Operating Temperature: -40 °C

Enables reliable operation even in extreme temperature conditions, expanding the product's usability.

Interface Standard: EIA-485; TIA-485; ISO 8482

Compliance with industry standards ensures compatibility with a wide range of devices and systems.

Nominal Supply Voltage: 5 V

Optimal voltage level for efficient performance and power consumption.

Technical Specifications

Line Drivers & Receivers HPA00893P attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485; TIA-485; ISO 8482

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Length:

9.59 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Receive Delay:

150 ns

Receiver No. of Bits:

1

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

1300 ns

Width:

7.62 mm

Trade Compliance

HPA00893P Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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