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HPA02239RUKR

Texas Instruments

HPA02239RUKR by Texas Instruments

Texas Instruments' HPA02239RUKR is a switching regulator with 20 terminals, operating b/w -40 to 125°C. It offers a max output current of 20A, PWM control technique, and BUCK switcher config. Ideal for automotive applications due to its MSL level of 2 and nominal input voltage of 12V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,098 parts In-Stock

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Digiode

USA . 4,978 parts In-Stock

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4,978

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 511 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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-

511

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 1,015 parts In-Stock

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$1.500

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1,015

$1.500

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One Stop Electronics

USA . 1,409 parts In-Stock

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$6.500

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$6.500

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Parana Technologies

USA . 18 parts In-Stock

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$11.902

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$12.300

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18

$11.902

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$12.300

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ChromeModa Solutions

Germany . 2,889 parts In-Stock

1+ parts

$13.373

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$10.966

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2,889

$13.373

$10.966

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IDEA Electronic Components Group

UK . 634 parts In-Stock

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$13.373

100+ parts

$12.704

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$12.036

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634

$13.373

$12.704

$12.036

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AZTECH Wire

Italy . 605 parts In-Stock

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$17.431

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605

$17.431

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Corphita

USA . 4,541 parts In-Stock

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Microchip USA

USA . 2,534 parts In-Stock

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2,534

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DigiPath Technology Company

USA . 969 parts In-Stock

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$12.057

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Corohmni

South Africa . 131 parts In-Stock

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Overview

Elevate your power management solutions with the HPA02239RUKR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality switching regulators & controllers that provide reliable performance in a compact package. This versatile chip carrier with a very thin profile is ideal for a wide range of applications, from automotive to industrial. With a maximum output current of 20A and a wide temperature range, this dual switching controller offers superior efficiency and reliability. Upgrade your power systems with the HPA02239RUKR and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for the package body ensures portability and long-lasting performance.

Surface Mount: YES

Enables easy and convenient installation onto circuit boards, saving time and effort.

No. of Terminals: 20

Sufficient terminals for connecting various components and peripherals, enhancing flexibility in circuit design.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in harsh environments, increasing reliability and versatility.

Maximum Output Voltage: 5.5 V

Higher maximum output voltage provides flexibility in powering different devices and components in a circuit.

Maximum Output Current: 20 A

High output current capability allows for powering multiple devices or components simultaneously without overheating or performance degradation.

Control Technique: PULSE WIDTH MODULATION

Efficient control technique ensures stable and precise voltage regulation, leading to optimal performance of the product.

Technical Specifications

Switching Regulators & Controllers HPA02239RUKR attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO AVAILABLE 5V OUTPUT VOLTAGE

Other IC type:

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

24 V

Minimum Input Voltage:

5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Outputs:

4

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

20 A

Maximum Output Voltage:

5.5 V

Minimum Output Voltage:

4.5 V

Nominal Output Voltage:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

355 kHz

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

HPA02239RUKR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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