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HPA00589RGCR

Texas Instruments

HPA00589RGCR by Texas Instruments

Texas Instruments' HPA00589RGCR is a 64-terminal switching controller with PWM control, operating at 3.3-3.6V input voltage range and 2000kHz max frequency. Designed for automotive applications, it features a compact chip carrier package with a low profile of 1mm, making it suitable for space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,806 parts In-Stock

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8,806

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Digiode

USA . 462 parts In-Stock

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462

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Distributors (Availability)

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Ampacity Inc.

Singapore . 713 parts In-Stock

1+ parts

$1.500

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713

$1.500

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Semicontronic

India . 1,224 parts In-Stock

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$3.500

100+ parts

$3.412

1k+ parts

$3.395

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1,224

$3.500

$3.412

$3.395

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One Stop Electronics

USA . 1,033 parts In-Stock

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$5.500

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1,033

$5.500

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AZTECH Wire

Italy . 360 parts In-Stock

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$6.154

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360

$6.154

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Parana Technologies

USA . 1,323 parts In-Stock

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$19.367

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$19.383

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1,323

$19.367

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$19.383

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DigiPath Technology Company

USA . 1,704 parts In-Stock

1+ parts

$21.326

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1,704

$21.326

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IDEA Electronic Components Group

UK . 2,168 parts In-Stock

1+ parts

$21.761

100+ parts

$20.673

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$19.585

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2,168

$21.761

$20.673

$19.585

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ChromeModa Solutions

Germany . 1,512 parts In-Stock

1+ parts

$21.761

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$17.844

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1,512

$21.761

$17.844

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Corphita

USA . 4,722 parts In-Stock

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4,722

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Microchip USA

USA . 1,879 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,460 parts In-Stock

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Corohmni

South Africa . 491 parts In-Stock

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491

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Overview

Enhance your electronic designs with the HPA00589RGCR by Texas Instruments, a high-quality switching regulator & controller that offers superior performance and reliability. Manufactured by a trusted industry leader, this product is ideal for a wide range of applications. With its advanced features and innovative design, customers can expect improved efficiency, precision, and stability in their projects. Experience the value and benefits that this versatile component brings to your circuits. Choose Texas Instruments for exceptional quality and unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for the package body, ensuring the product's longevity and performance.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Operating Temperature: 125 °C

Allows the product to operate in various environments without risk of overheating or malfunction.

Nominal Input Voltage: 3.3 V

Suitable for applications requiring a stable and regulated input voltage at 3.3 volts.

Control Technique: PULSE WIDTH MODULATION

Efficient control technique for precise regulation of output voltage, ensuring stable and reliable operation.

Technical Specifications

Switching Regulators & Controllers HPA00589RGCR attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

3.6 V

Minimum Input Voltage:

3 V

Nominal Input Voltage:

3.3 V

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

2000 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

9 mm

Trade Compliance

HPA00589RGCR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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