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HPA02208YZPR

Texas Instruments

HPA02208YZPR by Texas Instruments

The Texas Instruments HPA02208YZPR is a multiplexer with 2 functions, operating at temperatures from -40 to 85°C. It has a low on-state resistance of 0.15 ohm and fast switch-on time of 120 ns. Ideal for industrial applications requiring high isolation and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,997 parts In-Stock

1+ parts

-

100+ parts

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3,997

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Digiode

USA . 660 parts In-Stock

1+ parts

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660

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 665 parts In-Stock

1+ parts

$1.500

100+ parts

-

1k+ parts

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-

665

$1.500

-

-

-

Semicontronic

India . 590 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

10k+ parts

-

590

$2.500

$2.438

$2.425

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Ampacity Inc.

Singapore . 764 parts In-Stock

1+ parts

$3.500

100+ parts

-

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764

$3.500

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Parana Technologies

USA . 265 parts In-Stock

1+ parts

$7.185

100+ parts

-

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$7.694

10k+ parts

-

265

$7.185

-

$7.694

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DigiPath Technology Company

USA . 264 parts In-Stock

1+ parts

$7.912

100+ parts

$7.279

1k+ parts

-

10k+ parts

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264

$7.912

$7.279

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-

ChromeModa Solutions

Germany . 6,991 parts In-Stock

1+ parts

$8.073

100+ parts

$6.620

1k+ parts

-

10k+ parts

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6,991

$8.073

$6.620

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IDEA Electronic Components Group

UK . 680 parts In-Stock

1+ parts

$8.073

100+ parts

-

1k+ parts

$7.266

10k+ parts

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680

$8.073

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$7.266

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AZTECH Wire

Italy . 463 parts In-Stock

1+ parts

$12.814

100+ parts

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463

$12.814

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Lixinc

USA . 8,917 parts In-Stock

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8,917

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Kepictronics

USA . 3,407 parts In-Stock

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3,407

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Corphita

USA . 2,040 parts In-Stock

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2,040

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Corohmni

South Africa . 371 parts In-Stock

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371

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Overview

Upgrade your electronic devices with the high-quality HPA02208YZPR from Texas Instruments. This multiplexer & switch offers unparalleled performance and reliability, perfect for a wide range of applications. With its compact size, advanced features, and efficient design, this product provides value and benefits that are unmatched in the industry. Trust Texas Instruments to deliver cutting-edge technology that will take your projects to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting onto printed circuit boards, making installation quick and simple.

No. of Functions: 2

Having multiple functions in one device provides versatility and saves space on the circuit board.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to handle during assembly.

Power Supplies (V): 2.5/5

Compatible with a range of power supply voltages, offering flexibility in different operating environments.

No. of Terminals: 10

Sufficient number of terminals for connecting to various components in the circuit.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a thin profile and fine pitch allows for high-density mounting, saving space on the board.

Maximum Operating Temperature: 85 °C

Wide range of operating temperature allows for use in various environments without risk of overheating.

Minimum Operating Temperature: -40 °C

Able to operate in low temperatures, ensuring reliability in harsh conditions.

Terminal Finish: TIN SILVER COPPER

A combination of finishes that provide good conductivity and resistance to corrosion for longevity.

Terminal Position: BOTTOM

Bottom terminal position is convenient for easy connection to the circuit board.

Output (V): SEPARATE OUTPUT

Separate outputs for each function offer independent control and flexibility in signal routing.

Maximum Seated Height: 0.31 mm

Ultra-thin profile with low seated height saves space and allows for compact design.

Width (mm): 1.25 mm

Narrow width for efficient use of board space and compact layouts.

Other IC type: SPDT

SPDT (Single Pole Double Throw) configuration provides versatility in signal routing and switching options.

Minimum Supply Voltage (Vsup): 2.3 V

Compatible with low supply voltages, suitable for a wide range of applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand reflow soldering process for efficient and reliable assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures strong solder joints for durability.

Maximum On-state Resistance (Ron): 0.15 ohm

Low on-state resistance minimizes signal loss and ensures efficient operation.

Maximum Switch-on Time: 120 ns

Fast switch-on time for quick response in signal routing and switching.

Length: 2.25 mm

Compact length for space-saving designs and efficient board layouts.

Maximum Switch-off Time: 70 ns

Fast switch-off time ensures prompt disconnection of signals for efficient operation.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability in demanding environments.

Maximum Supply Current (Isup): 0.005 mA

Low supply current for power efficiency and minimal energy consumption.

No. of Channels: 2

Dual channels provide versatility and options for signal routing and switching.

Nominal Bandwidth: 18.3 kHz

Wide bandwidth for transmitting high-frequency signals without distortion or loss.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections to the circuit board.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and compact board designs.

Maximum Supply Voltage (Vsup): 5.5 V

Compatible with higher supply voltages for flexibility in various applications.

Normal Position (V): NO/NC

Ability to switch between normally open (NO) and normally closed (NC) positions for versatile signal routing.

Nominal Off-state Isolation: 68 dB

High off-state isolation ensures minimal interference and crosstalk between channels.

Minimum Input Voltage: -3.2 V

Ability to accept negative input voltages for versatile signal processing.

Switching (V): BREAK-BEFORE-MAKE

Break-before-make switching ensures smooth transitions between signal paths without short circuits.

Maximum Input Voltage: 5.5 V

High maximum input voltage tolerance for versatility in signal processing and compatibility with various devices.

Technical Specifications

Multiplexers & Switches HPA02208YZPR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

18.3 kHz

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

-3.2 V

JESD-30 Code:

R-XBGA-B10

JESD-609 Code:

e1

Length:

2.25 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO/NC

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

10

Nominal Off-state Isolation:

68 dB

Maximum On-state Resistance (Ron):

.15 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA10,3X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

.31 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.005 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Maximum Switch-off Time:

70 ns

Maximum Switch-on Time:

120 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.25 mm

Trade Compliance

HPA02208YZPR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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