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HPA02141EYFFR

Texas Instruments

HPA02141EYFFR by Texas Instruments

Texas Instruments' HPA02141EYFFR is a 16-terminal multiplexer with 2 functions, operating at a supply voltage of 2.7-4.5V. With a max on-state resistance of 10 ohm and industrial temperature grade, it's ideal for audio/video switching applications. The IC features separate outputs, bottom terminal position, and very thin profile grid array package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,811 parts In-Stock

1+ parts

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6,811

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Digiode

USA . 379 parts In-Stock

1+ parts

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379

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 377 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

377

$0.500

$0.488

$0.485

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One Stop Electronics

USA . 158 parts In-Stock

1+ parts

$1.500

100+ parts

-

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158

$1.500

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Parana Technologies

USA . 2,056 parts In-Stock

1+ parts

$3.505

100+ parts

-

1k+ parts

$4.030

10k+ parts

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2,056

$3.505

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$4.030

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DigiPath Technology Company

USA . 862 parts In-Stock

1+ parts

$3.859

100+ parts

$3.551

1k+ parts

-

10k+ parts

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862

$3.859

$3.551

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ChromeModa Solutions

Germany . 6,891 parts In-Stock

1+ parts

$3.938

100+ parts

$3.229

1k+ parts

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6,891

$3.938

$3.229

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IDEA Electronic Components Group

UK . 1,263 parts In-Stock

1+ parts

$3.938

100+ parts

-

1k+ parts

$3.544

10k+ parts

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1,263

$3.938

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$3.544

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Ampacity Inc.

Singapore . 574 parts In-Stock

1+ parts

$5.500

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574

$5.500

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AZTECH Wire

Italy . 777 parts In-Stock

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$6.026

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777

$6.026

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Corphita

USA . 3,245 parts In-Stock

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3,245

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Corohmni

South Africa . 98 parts In-Stock

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98

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Overview

Enhance your electronic designs with the HPA02141EYFFR by Texas Instruments, a top-tier manufacturer known for quality and reliability in the world of multiplexers & switches. This versatile component offers a myriad of applications in audio/video switches with separate output, ideal for industrial-grade projects. With a nominal supply voltage of 3.3V and a maximum operating temperature of 85°C, this SQUARE package style IC provides exceptional performance in a compact form factor. Elevate your products with the value and benefits that only Texas Instruments can deliver.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product ideal for mass production.

No. of Functions: 2

Having multiple functions in one device saves space on the PCB and reduces the need for additional components, simplifying the overall design.

Package Shape: SQUARE

The square package shape is commonly used and helps in easy placement and orientation during PCB assembly.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a standard voltage level of 3.3V makes it compatible with a wide range of digital systems and applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product is suitable for industrial applications where temperature fluctuations are common.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity, reliability, and solderability for robust connections.

Output (V): SEPARATE OUTPUT

Having separate output terminals allows for easier integration into different signal pathways without interference.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching feature ensures that there is no overlap between switching pathways, preventing signal distortion or short circuits.

Technical Specifications

Multiplexers & Switches HPA02141EYFFR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Maximum Input Voltage:

4.5 V

Minimum Input Voltage:

2.7 V

JESD-30 Code:

S-XBGA-B16

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Functions:

2

No. of Terminals:

16

Maximum On-state Resistance (Ron):

10 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA16,4X4,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Positive Input Voltage:

4.5 V

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.425 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.01 mA

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

HPA02141EYFFR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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