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HPA02302YZPR

Texas Instruments

HPA02302YZPR by Texas Instruments

Texas Instruments HPA02302YZPR is a 2-function SPDT multiplexer with 10 terminals. It operates at -40 to 85°C, with on-state resistance of 1.04 ohm and switching time of 80 ns. Suitable for industrial applications requiring separate output voltages in a compact grid array package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,709 parts In-Stock

1+ parts

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6,709

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Digiode

USA . 3,423 parts In-Stock

1+ parts

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3,423

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,252 parts In-Stock

1+ parts

$3.500

100+ parts

-

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1,252

$3.500

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One Stop Electronics

USA . 379 parts In-Stock

1+ parts

$3.500

100+ parts

-

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379

$3.500

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Semicontronic

India . 888 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

10k+ parts

-

888

$4.500

$4.388

$4.365

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AZTECH Wire

Italy . 351 parts In-Stock

1+ parts

$6.629

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351

$6.629

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Parana Technologies

USA . 1,297 parts In-Stock

1+ parts

$18.110

100+ parts

$1,681.762

1k+ parts

$16.299

10k+ parts

-

1,297

$18.110

$1,681.762

$16.299

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DigiPath Technology Company

USA . 1,244 parts In-Stock

1+ parts

$19.941

100+ parts

$18.346

1k+ parts

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1,244

$19.941

$18.346

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IDEA Electronic Components Group

UK . 1,859 parts In-Stock

1+ parts

$20.348

100+ parts

$19.331

1k+ parts

$18.313

10k+ parts

-

1,859

$20.348

$19.331

$18.313

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ChromeModa Solutions

Germany . 1,672 parts In-Stock

1+ parts

$20.348

100+ parts

$16.685

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1,672

$20.348

$16.685

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Corphita

USA . 1,678 parts In-Stock

1+ parts

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1,678

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Corohmni

South Africa . 500 parts In-Stock

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500

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the HPA02302YZPR multiplexer. This versatile component offers seamless switching between two functions, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this product delivers superior performance and efficiency. Trust in Texas Instruments to provide you with cutting-edge technology that enhances your projects and simplifies your designs. Elevate your work with the HPA02302YZPR and experience the difference of industry-leading innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for the package body, ensuring longevity and stability of the product.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Offers versatility in switching between multiple functions, providing flexibility in usage.

Power Supplies (V): 2.5/5

Supports multiple power supply voltages, making it compatible with a variety of systems.

No. of Terminals: 10

Sufficient number of terminals for connecting to different components and circuits, enabling seamless integration.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environments or conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperatures, making it suitable for diverse applications.

Terminal Finish: TIN SILVER COPPER

High-quality terminal finish for improved conductivity and durability, ensuring stable connections.

Maximum Switch-on Time: 80 ns

Fast switch-on time reduces latency in signal switching, enhancing overall efficiency.

Switching (V): BREAK-BEFORE-MAKE

Ensures seamless transition between different states, preventing any short circuits or voltage spikes.

Technical Specifications

Multiplexers & Switches HPA02302YZPR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B10

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO/NC

No. of Functions:

2

No. of Terminals:

10

Maximum On-state Resistance (Ron):

1.04 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA10,3X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

80 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

HPA02302YZPR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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