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HPA01085DBVR

Texas Instruments

HPA01085DBVR by Texas Instruments

Texas Instruments' HPA01085DBVR is a BICMOS technology-based LDO regulator with 5 terminals. It operates b/w -40 to 125 °C, tolerating voltage up to 2%. With a small outline and low profile package style, it suits applications requiring fixed positive single output regulators with a max output current of 0.2 A.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,643 parts In-Stock

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4,643

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Digiode

USA . 1,109 parts In-Stock

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1,109

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Distributors (Availability)

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One Stop Electronics

USA . 1,635 parts In-Stock

1+ parts

$1.500

100+ parts

-

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1,635

$1.500

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Parana Technologies

USA . 608 parts In-Stock

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$6.268

100+ parts

-

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$7.024

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608

$6.268

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$7.024

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DigiPath Technology Company

USA . 2,126 parts In-Stock

1+ parts

$6.902

100+ parts

$6.350

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2,126

$6.902

$6.350

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ChromeModa Solutions

Germany . 3,559 parts In-Stock

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$7.043

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$5.775

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3,559

$7.043

$5.775

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IDEA Electronic Components Group

UK . 2,240 parts In-Stock

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$7.043

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$6.339

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2,240

$7.043

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$6.339

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Semicontronic

India . 135 parts In-Stock

1+ parts

$10.500

100+ parts

$10.238

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$10.185

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135

$10.500

$10.238

$10.185

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AZTECH Wire

Italy . 283 parts In-Stock

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$15.750

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283

$15.750

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A-Z Elektronik GmbH

Germany . 7,001 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,667 parts In-Stock

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Corphita

USA . 4,183 parts In-Stock

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Kepictronics

USA . 462 parts In-Stock

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462

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Corohmni

South Africa . 235 parts In-Stock

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Overview

Enhance your electronic designs with the HPA01085DBVR by Texas Instruments, a high-quality Fixed Regulator that offers reliable performance and precision. Manufactured by Texas Instruments, a reputable industry leader, this LDO regulator is perfect for a wide range of applications. With its compact size, low profile design, and efficient output, this product provides exceptional value and benefits to customers. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Experience the difference with the HPA01085DBVR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects internal components, ensuring longevity of the product.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Operating Temperature (TJ-Max): 125 °C

Can operate efficiently at high temperatures, making it suitable for various industrial applications.

Technology: BICMOS

Utilizes both bipolar and CMOS technologies, offering high performance and low power consumption.

Package Shape: RECTANGULAR

Saves space on the PCB and allows for efficient placement in tight spaces.

Terminal Form: GULL WING

Enables easy soldering and secure connection to the PCB, ensuring reliable performance.

Operating Temperature (TJ-Min): -40 °C

Can operate in extremely low temperatures, making it suitable for outdoor or harsh environments.

Adjustability: FIXED

Provides a stable output voltage without the need for manual adjustments, ensuring consistent performance.

Maximum Output Current: 1.2 A

Capable of supplying high current output, making it suitable for powering various components in a circuit.

Minimum Input Voltage: 2.7 V

Works efficiently even with low input voltages, ensuring compatibility with a wide range of power sources.

Technical Specifications

Fixed Regulators - Positive Single Output LDO HPA01085DBVR attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Texas Instruments

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

.112 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.7 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.45 mm

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

2 %

Width:

1.6 mm

Trade Compliance

HPA01085DBVR Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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