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HPA01054DAPR

Texas Instruments

HPA01054DAPR by Texas Instruments

The Texas Instruments HPA01054DAPR is a graphics display driver with 32 terminals, operating at 3-3.5V. It features constant-current output, standard input mode, and a max supply current of 90mA. Ideal for LED displays in industrial applications due to its small outline package and wide temperature range from -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,468 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,468

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Digiode

USA . 2,996 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,996

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,991 parts In-Stock

1+ parts

$5.067

100+ parts

-

1k+ parts

$5.636

10k+ parts

-

1,991

$5.067

-

$5.636

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DigiPath Technology Company

USA . 1,730 parts In-Stock

1+ parts

$5.579

100+ parts

$5.133

1k+ parts

-

10k+ parts

-

1,730

$5.579

$5.133

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ChromeModa Solutions

Germany . 2,812 parts In-Stock

1+ parts

$5.693

100+ parts

$4.668

1k+ parts

-

10k+ parts

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2,812

$5.693

$4.668

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IDEA Electronic Components Group

UK . 2,265 parts In-Stock

1+ parts

$5.693

100+ parts

-

1k+ parts

$5.124

10k+ parts

-

2,265

$5.693

-

$5.124

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AZTECH Wire

Italy . 360 parts In-Stock

1+ parts

$10.689

100+ parts

-

1k+ parts

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10k+ parts

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360

$10.689

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One Stop Electronics

USA . 835 parts In-Stock

1+ parts

$28.500

100+ parts

-

1k+ parts

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10k+ parts

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835

$28.500

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Corphita

USA . 4,865 parts In-Stock

1+ parts

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4,865

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Overview

Elevate your display driver experience with the HPA01054DAPR by Texas Instruments. Crafted with precision and expertise, this graphics display driver offers unparalleled quality and reliability. Perfect for a wide range of applications, this product boasts a sleek design and efficient performance. Say goodbye to outdated models and hello to cutting-edge technology that delivers value and benefits like never before. Upgrade your display driver game with Texas Instruments and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the display driver lightweight and durable.

Data Input Mode: SERIAL

The serial data input mode allows for efficient communication and data transfer between devices, making it ideal for display driver applications.

Surface Mount: YES

Being surface mount compatible makes the display driver easy to integrate onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.5 V

The high maximum supply voltage ensures compatibility with a wide range of systems and power sources.

Package Shape: RECTANGULAR

The rectangular package shape is standard and easily accommodated in electronic designs, making it a versatile option for various applications.

No. of Terminals: 32

Having a higher number of terminals allows for more connections and functionality in the display driver, enabling it to control a larger display or more advanced features.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures the display driver can function reliably in various environmental conditions without overheating.

Output Characteristics: CONSTANT-CURRENT

The constant-current output characteristics ensure stable and consistent performance, crucial for driving LEDs in displays with uniform brightness.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the display driver to function in cold environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and durability.

Terminal Position: DUAL

Having dual terminal positions allows for redundancy and flexibility in circuit design, enhancing the reliability and versatility of the display driver.

Maximum Seated Height: 1.2 mm

The low maximum seated height enables a compact design for the display driver, making it suitable for thin and space-constrained applications.

Width: 6.1 mm

The narrow width of the display driver makes it easy to fit into tight spaces, making it ideal for compact electronic devices and displays.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient assembly processes, reducing production time and costs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering and reworking processes, ensuring a robust and durable connection.

Length: 11 mm

The compact length of the display driver makes it suitable for small electronic devices and applications where space is limited.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that the display driver is designed to withstand harsh operating conditions, making it suitable for industrial applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering, ensuring secure and reliable connections in the display driver.

Maximum Supply Current: 90 mA

The high maximum supply current capability allows the display driver to power multiple LEDs or drive larger displays without issues.

Input Characteristics: STANDARD

Having standard input characteristics ensures compatibility with a wide range of systems and devices, making the display driver versatile and easy to integrate.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage provides stable power to the display driver, ensuring consistent performance and brightness levels in the connected display.

No. of Segments: 24

The high number of segments enables the display driver to control a large number of individual display elements, making it suitable for driving multi-segment displays.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for high-density mounting of the display driver on circuit boards, enabling compact and space-saving designs.

Minimum fmax: 30 MHz

The high minimum fmax frequency rating indicates fast signal processing capabilities, making the display driver suitable for high-speed display applications.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the display driver has moderate moisture sensitivity, allowing for safe storage and handling in humid environments.

Interface IC Type: LED DISPLAY DRIVER

Being specifically designed as an LED display driver ensures optimized performance and compatibility with LED-based displays, making it an ideal choice for driving LEDs in various applications.

Technical Specifications

Graphics Display Drivers HPA01054DAPR attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Additional Features:

HTTP://WWW.TI.COM/LIT/ML/MPDS380/MPDS380.PDF

Data Input Mode:

SERIAL

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e4

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

24

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

CONSTANT-CURRENT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

3.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Minimum fmax:

30 MHz

Trade Compliance

HPA01054DAPR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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