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HPA01116RHBR

Texas Instruments

HPA01116RHBR by Texas Instruments

Texas Instruments' HPA01116RHBR is a graphics display driver with 32 terminals, operating at -40 to 85°C. It features a serial data input mode, 3-5.5V supply voltage range, and quad terminal position. Ideal for LED displays, this chip carrier package has a very thin profile and is surface-mountable for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,624 parts In-Stock

1+ parts

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8,624

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Digiode

USA . 3,396 parts In-Stock

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3,396

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Nova Conductors

Japan . 75 parts In-Stock

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75

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,664 parts In-Stock

1+ parts

$10.382

100+ parts

-

1k+ parts

$10.896

10k+ parts

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1,664

$10.382

-

$10.896

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AZTECH Wire

Italy . 425 parts In-Stock

1+ parts

$10.498

100+ parts

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425

$10.498

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DigiPath Technology Company

USA . 1,502 parts In-Stock

1+ parts

$11.432

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1,502

$11.432

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ChromeModa Solutions

Germany . 2,006 parts In-Stock

1+ parts

$11.665

100+ parts

$9.565

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2,006

$11.665

$9.565

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IDEA Electronic Components Group

UK . 473 parts In-Stock

1+ parts

$11.665

100+ parts

$11.082

1k+ parts

$10.498

10k+ parts

-

473

$11.665

$11.082

$10.498

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Semicontronic

India . 1,177 parts In-Stock

1+ parts

$12.500

100+ parts

$12.188

1k+ parts

$12.125

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1,177

$12.500

$12.188

$12.125

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Corohmni

South Africa . 622 parts In-Stock

1+ parts

$13.513

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622

$13.513

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Ampacity Inc.

Singapore . 885 parts In-Stock

1+ parts

$20.500

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885

$20.500

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One Stop Electronics

USA . 1,529 parts In-Stock

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$36.500

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1,529

$36.500

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Corphita

USA . 4,784 parts In-Stock

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4,784

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Continental Prestige Electronics

USA . 3,957 parts In-Stock

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3,957

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Microchip USA

USA . 2,908 parts In-Stock

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2,908

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Advanced Electronics

New Zealand . 856 parts In-Stock

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856

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Argo Parts USA

USA . 4 parts In-Stock

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4

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Overview

Elevate your display solutions with the cutting-edge HPA01116RHBR by Texas Instruments. Crafted with precision and expertise, this graphics display driver delivers unparalleled performance, versatility, and reliability. Whether you're designing consumer electronics, automotive displays, or industrial control panels, this product offers seamless integration, maximum efficiency, and exceptional quality. Experience the difference with Texas Instruments and unlock endless possibilities for your next project. Elevate your display solutions with the HPA01116RHBR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the graphics display driver, making it a reliable choice for long-term use.

Data Input Mode: SERIAL

Serial data input mode allows for efficient and organized data transmission, enhancing the performance of the graphics display driver.

Surface Mount: YES

Surface mount capability makes installation easy and space-efficient, suitable for compact devices or applications with limited space.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage allows for flexibility in power input, accommodating a range of voltage requirements.

Package Shape: SQUARE

Square package shape offers a balanced and compact design, ideal for integration into various electronic setups.

No. of Terminals: 32

A higher number of terminals provide more connectivity options and features, enabling versatile functionality for the graphics display driver.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Chip carrier, heat sink/slug, and thin profile package styles contribute to efficient heat dissipation and space-saving design, enhancing the performance and reliability of the graphics display driver.

Minimum Supply Voltage: 3 V

Low minimum supply voltage helps in energy efficiency and compatibility with devices that have lower power requirements.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the graphics display driver to function reliably in demanding environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures ensures that the graphics display driver can work in both extreme cold and hot conditions, expanding its usability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term performance and reliability of the graphics display driver.

Terminal Position: QUAD

Quad terminal position offers stability and secure connections, reducing the chances of signal loss or interference in the graphics display driver.

Maximum Seated Height: 1 mm

Low maximum seated height allows for a compact and slim design, suitable for applications with space constraints.

Width: 5 mm

Narrow width makes the graphics display driver suitable for devices with limited space, ensuring seamless integration and efficient use of available area.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables reliable soldering and assembly processes, enhancing the durability and longevity of the graphics display driver.

Length: 5 mm

Short length contributes to a compact form factor, making the graphics display driver suitable for small and portable devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the graphics display driver can withstand harsh industrial environments and fulfill demanding operational requirements.

Terminal Form: NO LEAD

No-lead terminal form is environmentally friendly and ensures compliance with RoHS regulations, making the graphics display driver a sustainable choice.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage promotes consistent performance and compatibility with a wide range of devices, enhancing the overall reliability of the graphics display driver.

No. of Segments: 24

A higher number of segments allow for more detailed and versatile display options, making the graphics display driver suitable for a variety of applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables precise connections and compact design, ensuring reliable performance and efficient use of space in the graphics display driver.

Minimum fmax: 30 MHz

High minimum fmax (maximum operating frequency) indicates fast data processing capabilities, suitable for high-speed and responsive graphics display applications.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level of 2 indicates that the graphics display driver is moderately sensitive to moisture exposure, requiring standard handling and storage procedures.

Interface IC Type: LED DISPLAY DRIVER

Interface IC type of LED display driver ensures compatibility with LED displays, offering efficient control and management of display functions for enhanced user experience.

Technical Specifications

Graphics Display Drivers HPA01116RHBR attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

24

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Minimum fmax:

30 MHz

Trade Compliance

HPA01116RHBR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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