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HPA00030DAPR

Texas Instruments

HPA00030DAPR by Texas Instruments

Texas Instruments' HPA00030DAPR is a Graphics Display Driver with 32 terminals, operating at -40 to 85°C. It features a serial data input mode, 5.5V max supply voltage, and 30MHz min fmax. Ideal for LED display driver applications in industrial settings due to its compact size and high temperature tolerance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,403 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,403

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-

-

-

Digiode

USA . 4,505 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,505

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,822 parts In-Stock

1+ parts

$8.032

100+ parts

-

1k+ parts

$8.612

10k+ parts

-

1,822

$8.032

-

$8.612

-

DigiPath Technology Company

USA . 2,094 parts In-Stock

1+ parts

$8.844

100+ parts

$8.137

1k+ parts

-

10k+ parts

-

2,094

$8.844

$8.137

-

-

ChromeModa Solutions

Germany . 3,274 parts In-Stock

1+ parts

$9.025

100+ parts

$7.400

1k+ parts

-

10k+ parts

-

3,274

$9.025

$7.400

-

-

IDEA Electronic Components Group

UK . 1,390 parts In-Stock

1+ parts

$9.025

100+ parts

$8.574

1k+ parts

$8.122

10k+ parts

-

1,390

$9.025

$8.574

$8.122

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AZTECH Wire

Italy . 680 parts In-Stock

1+ parts

$10.643

100+ parts

-

1k+ parts

-

10k+ parts

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680

$10.643

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-

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One Stop Electronics

USA . 657 parts In-Stock

1+ parts

$38.500

100+ parts

-

1k+ parts

-

10k+ parts

-

657

$38.500

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-

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Corphita

USA . 3,879 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,879

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Overview

Elevate your display solutions with the HPA00030DAPR by Texas Instruments, a top-tier manufacturer known for delivering high-quality Graphics Display Drivers. Designed for seamless integration and maximum performance, this product offers unparalleled value to customers looking to elevate their visual experiences. Whether used in industrial settings or consumer electronics, the HPA00030DAPR ensures reliability and efficiency, making it a standout choice for all your display driver needs. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the drivers, making them suitable for various applications.

Data Input Mode: SERIAL

Serial data input mode allows for secure and efficient communication between devices, ensuring reliable data transmission.

Surface Mount: YES

Surface mount capability makes installation easier and saves space on the PCB, making the product ideal for compact designs.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage allows for flexibility in power input and ensures compatibility with a wide range of systems.

Minimum Supply Voltage: 3 V

Lower minimum supply voltage enables energy efficiency and reduces power consumption, making the product cost-effective.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions, increasing the product's longevity.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the drivers to operate in extreme cold environments without compromising performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Quality terminal finish enhances conductivity, prevents corrosion, and ensures long-term reliability of the graphics display drivers.

Maximum Seated Height: 1.2 mm

Low seated height makes the product suitable for compact designs and contributes to space-saving on the PCB.

Width: 6.1 mm

Narrow width allows for efficient placement on the PCB and enables the drivers to be used in space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the drivers can withstand harsh operating conditions common in industrial environments.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical connections and facilitates easy soldering during the assembly process.

No. of Segments: 16

Multiple segments provide versatility in display configurations, allowing for the implementation of various screen layouts and visual content.

Minimum fmax: 30 MHz

High minimum fmax frequency ensures fast data processing and display refresh rates, delivering smooth and high-quality graphics.

Technical Specifications

Graphics Display Drivers HPA00030DAPR attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e4

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Minimum fmax:

30 MHz

Trade Compliance

HPA00030DAPR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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