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HPA00765IYZGR

Texas Instruments

HPA00765IYZGR by Texas Instruments

Texas Instruments' HPA00765IYZGR is a consumer IC with 12 terminals in a grid array package. Operating b/w -40 to 85°C, it supports supply voltages from 1.2V to 3.6V. Ideal for industrial applications requiring CMOS technology and fine pitch terminal connections at a very thin profile of 0.625mm height.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,601 parts In-Stock

1+ parts

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3,601

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Digiode

USA . 2,180 parts In-Stock

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2,180

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 578 parts In-Stock

1+ parts

$1.331

100+ parts

-

1k+ parts

$2.066

10k+ parts

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578

$1.331

-

$2.066

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DigiPath Technology Company

USA . 702 parts In-Stock

1+ parts

$1.465

100+ parts

-

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702

$1.465

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IDEA Electronic Components Group

UK . 2,038 parts In-Stock

1+ parts

$1.495

100+ parts

-

1k+ parts

$1.346

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2,038

$1.495

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$1.346

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ChromeModa Solutions

Germany . 1,827 parts In-Stock

1+ parts

$1.495

100+ parts

$1.226

1k+ parts

-

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1,827

$1.495

$1.226

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AZTECH Wire

Italy . 786 parts In-Stock

1+ parts

$17.328

100+ parts

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786

$17.328

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One Stop Electronics

USA . 1,408 parts In-Stock

1+ parts

$21.800

100+ parts

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1,408

$21.800

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Corphita

USA . 4,178 parts In-Stock

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4,178

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Microchip USA

USA . 1,021 parts In-Stock

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1,021

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Overview

Discover the high-quality HPA00765IYZGR by Texas Instruments, a cutting-edge consumer IC that offers unparalleled performance and reliability. Manufactured by the reputable Texas Instruments, this rectangular package IC is perfect for a wide range of applications. With a very thin profile and fine pitch, this grid array IC is designed to exceed your expectations. Trust Texas Instruments to deliver exceptional value and benefits with their innovative technological solutions. Elevate your projects with the HPA00765IYZGR and experience the advantages it brings to your designs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto printed circuit boards, saving time and cost during manufacturing.

Package Shape: RECTANGULAR

Rectangular package shape provides compatibility with standard PCB layouts, ensuring easy integration into existing designs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring reliability and performance in everyday electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and maintain stable performance.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for operation in extreme cold environments, making it suitable for a variety of applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin, silver, and copper for terminal finish ensures good conductivity and reliability, enhancing the longevity of the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy efficient and reliable in noisy environments.

Maximum Supply Voltage: 3.6 V

Support for a wide range of supply voltages allows for compatibility with different power sources, increasing the versatility of the product.

Technical Specifications

Other Function Consumer ICs HPA00765IYZGR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-XBGA-B12

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

HPA00765IYZGR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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