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HPA00126DGGR

Texas Instruments

HPA00126DGGR by Texas Instruments

Texas Instruments HPA00126DGGR is Clock Driver & Buffer with 48 terminals, operating at -40 to 85 °C. Features include 20 true outputs, 220 MHz fmax, and differential mux input conditioning. Ideal for industrial applications requiring small outline package with shrink pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,988 parts In-Stock

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Vyrian

USA . 1,982 parts In-Stock

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Andel Nordic

Denmark . 170 parts In-Stock

1+ parts

$2.921

100+ parts

-

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$2.804

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$2.804

170

$2.921

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$2.804

$2.804

AZTECH Wire

Italy . 364 parts In-Stock

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$10.696

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$10.696

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Parana Technologies

USA . 999 parts In-Stock

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$22.271

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$22.941

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$22.271

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DigiPath Technology Company

USA . 667 parts In-Stock

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$24.524

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$22.562

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One Stop Electronics

USA . 1,024 parts In-Stock

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$25.000

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$25.000

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IDEA Electronic Components Group

UK . 2,239 parts In-Stock

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$25.024

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$23.773

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$22.522

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2,239

$25.024

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ChromeModa Solutions

Germany . 1,381 parts In-Stock

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$25.024

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$20.520

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QUARKTWIN TECHNOLOGY LTD

USA . 10,633 parts In-Stock

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Corphita

USA . 2,684 parts In-Stock

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Microchip USA

USA . 2,622 parts In-Stock

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Overview

Discover the innovative HPA00126DGGR by Texas Instruments, a top-of-the-line Clock Drivers & Buffers designed to elevate your electronic projects. With Texas Instruments' renowned quality and expertise, this product boasts superior performance and reliability. Perfect for a variety of applications, this small outline, thin profile package offers 20 true outputs and operates effortlessly in industrial settings. Unlock the potential of your designs with the HPA00126DGGR, providing unmatched value and precision for all your clock driver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface-mountable allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Input Conditioning: DIFFERENTIAL MUX

The differential MUX input conditioning ensures reliable data transmission and noise immunity, making it ideal for high-performance systems.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V supply voltage is suitable for low-power applications, reducing energy consumption and heat dissipation.

No. of Terminals: 48

Having 48 terminals provides flexibility in connecting various components, enabling complex circuit designs and functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding environments.

Output Characteristics: 3-STATE

The 3-STATE output allows for tristate logic functionality, expanding the versatility of the product in different circuit configurations.

Width: 6.1 mm

The compact width of 6.1mm saves space on the circuit board, enabling dense and efficient PCB layouts.

Minimum Supply Voltage (Vsup): 2.3 V

The low minimum supply voltage requirement of 2.3V ensures compatibility with a wide range of power sources, enhancing usability.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting of components, facilitating miniaturization and compact designs.

Technical Specifications

Clock Drivers & Buffers HPA00126DGGR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDCV

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Same Edge Skew (tskwd):

.04 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Minimum fmax:

220 MHz

Trade Compliance

HPA00126DGGR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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