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HPA00071ZQLR

Texas Instruments

HPA00071ZQLR by Texas Instruments

HPA00071ZQLR clock driver by Texas Instruments features a 52-terminal grid array package with a very thin profile and fine pitch. It operates at a nominal voltage of 1.8V, offering differential input conditioning and 10 true outputs at a min frequency of 400MHz. Ideal for applications requiring precise timing control in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,256 parts In-Stock

1+ parts

-

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4,256

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Vyrian

USA . 2,335 parts In-Stock

1+ parts

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2,335

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 466 parts In-Stock

1+ parts

$6.743

100+ parts

-

1k+ parts

$6.473

10k+ parts

$6.473

466

$6.743

-

$6.473

$6.473

AZTECH Wire

Italy . 715 parts In-Stock

1+ parts

$11.454

100+ parts

-

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715

$11.454

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One Stop Electronics

USA . 814 parts In-Stock

1+ parts

$17.000

100+ parts

-

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814

$17.000

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Parana Technologies

USA . 1,536 parts In-Stock

1+ parts

$20.623

100+ parts

-

1k+ parts

$20.724

10k+ parts

-

1,536

$20.623

-

$20.724

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DigiPath Technology Company

USA . 560 parts In-Stock

1+ parts

$22.709

100+ parts

-

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10k+ parts

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560

$22.709

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ChromeModa Solutions

Germany . 4,375 parts In-Stock

1+ parts

$23.172

100+ parts

$19.001

1k+ parts

-

10k+ parts

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4,375

$23.172

$19.001

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IDEA Electronic Components Group

UK . 1,081 parts In-Stock

1+ parts

$23.172

100+ parts

$22.013

1k+ parts

$20.855

10k+ parts

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1,081

$23.172

$22.013

$20.855

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Corphita

USA . 1,729 parts In-Stock

1+ parts

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1,729

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Overview

Unlock the potential of your electronic devices with the high-quality Clock Drivers & Buffers by Texas Instruments. Designed with precision and reliability in mind, this product offers unmatched performance and efficiency for a wide range of applications. With its advanced features and innovative design, the HPA00071ZQLR provides customers with unparalleled value, benefits, and advantages. Upgrade your electronics today and experience the superior quality that Texas Instruments has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Input Conditioning: DIFFERENTIAL

Ensures stable and accurate signal processing, resulting in reliable performance.

Nominal Supply Voltage / Vsup (V): 1.8

Optimal supply voltage for efficient operation and power consumption.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, making it suitable for a variety of applications.

Technical Specifications

Clock Drivers & Buffers HPA00071ZQLR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

877

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PBGA-B52

JESD-609 Code:

e1

Length:

7 mm

Logic IC Type:

Maximum I (ol):

9 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA52,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

235 mA

Maximum Same Edge Skew (tskwd):

.035 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.5 mm

Minimum fmax:

400 MHz

Trade Compliance

HPA00071ZQLR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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