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HPA00015PWR

Texas Instruments

HPA00015PWR by Texas Instruments

The Texas Instruments HPA00015PWR clock driver has a propagation delay of 3.9 ns, operates at a nominal voltage of 3.3V, and offers 10 true outputs. It is used for input conditioning in applications requiring precise timing control, such as high-speed data communication systems or digital signal processing circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,643 parts In-Stock

1+ parts

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6,643

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Digiode

USA . 647 parts In-Stock

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647

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,000 parts In-Stock

1+ parts

$6.649

100+ parts

-

1k+ parts

$6.383

10k+ parts

$6.383

1,000

$6.649

-

$6.383

$6.383

AZTECH Wire

Italy . 322 parts In-Stock

1+ parts

$11.023

100+ parts

-

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322

$11.023

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Parana Technologies

USA . 2,276 parts In-Stock

1+ parts

$27.520

100+ parts

-

1k+ parts

$36.873

10k+ parts

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2,276

$27.520

-

$36.873

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DigiPath Technology Company

USA . 285 parts In-Stock

1+ parts

$30.303

100+ parts

$27.878

1k+ parts

-

10k+ parts

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285

$30.303

$27.878

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ChromeModa Solutions

Germany . 3,077 parts In-Stock

1+ parts

$30.921

100+ parts

$25.355

1k+ parts

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3,077

$30.921

$25.355

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IDEA Electronic Components Group

UK . 344 parts In-Stock

1+ parts

$30.921

100+ parts

$29.375

1k+ parts

$27.829

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-

344

$30.921

$29.375

$27.829

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One Stop Electronics

USA . 160 parts In-Stock

1+ parts

$42.000

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160

$42.000

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Corphita

USA . 2,718 parts In-Stock

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2,718

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Overview

Enhance your electronic designs with the top-quality HPA00015PWR clock driver by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures reliability and efficiency in all its products. Ideal for applications in clock drivers and buffers, this product offers unmatched value with its low propagation delay and high performance. With features like surface mount capability and small outline packaging, this clock driver provides seamless integration into your projects. Trust Texas Instruments for superior quality components that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and ensures a lightweight design, making it suitable for various applications.

Propagation Delay At Nominal Supply: 3.9 ns

The low propagation delay ensures efficient and fast signal transmission, ideal for high-speed clock applications.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on PCBs, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is commonly used in digital circuits, providing compatibility with a wide range of electronic devices.

Load Capacitance (CL): 25 pF

The low load capacitance of 25 pF ensures minimal signal distortion and accurate timing, essential for clock driver applications.

No. of Terminals: 24

With 24 terminals, this clock driver offers versatile connectivity options for various input and output configurations.

Maximum I (ol): 12 Amp

The high output current capability of 12 Amps enables driving multiple loads or components without the need for external amplification.

Maximum Operating Temperature: 85 °C

The wide operating temperature range of up to 85°C ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this clock driver can function effectively in both cold and hot environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Technical Specifications

Clock Drivers & Buffers HPA00015PWR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDCV

Input Conditioning:

MUX

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Load Capacitance (CL):

25 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay At Nominal Supply:

3.9 ns

Propagation Delay (tpd):

3.9 ns

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

175 MHz

Trade Compliance

HPA00015PWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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