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GD65232PWG4

Texas Instruments

GD65232PWG4 by Texas Instruments

GD65232PWG4 by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at temperatures from -40 to 85 °C. It has a max supply voltage of 5.5 V and can handle power supplies of 5, +-9/+-12 V. This IC is ideal for industrial applications requiring EIA-232-F, TIA-232-F, and V.28 interface standards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,337 parts In-Stock

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6,337

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Digiode

USA . 117 parts In-Stock

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117

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 129 parts In-Stock

1+ parts

$1.958

100+ parts

-

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129

$1.958

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Northwest PG Solutions

USA . 539 parts In-Stock

1+ parts

$2.154

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539

$2.154

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Parana Technologies

USA . 1,883 parts In-Stock

1+ parts

$10.844

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$11.322

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1,883

$10.844

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$11.322

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DigiPath Technology Company

USA . 1,594 parts In-Stock

1+ parts

$11.940

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$10.985

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1,594

$11.940

$10.985

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ChromeModa Solutions

Germany . 1,850 parts In-Stock

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$12.184

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$9.991

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1,850

$12.184

$9.991

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IDEA Electronic Components Group

UK . 1,179 parts In-Stock

1+ parts

$12.184

100+ parts

$11.575

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$10.966

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1,179

$12.184

$11.575

$10.966

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AZTECH Wire

Italy . 429 parts In-Stock

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$18.167

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429

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One Stop Electronics

USA . 1,122 parts In-Stock

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$24.500

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$24.500

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QUARKTWIN TECHNOLOGY LTD

USA . 10,794 parts In-Stock

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Microchip USA

USA . 4,498 parts In-Stock

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Corphita

USA . 1,001 parts In-Stock

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Overview

Enhance your communication systems with the Texas Instruments GD65232PWG4 line driver & receiver. Manufactured with top-notch quality and reliability, this product offers unmatched advantages for various applications. From industrial settings to consumer electronics, this versatile component ensures optimal performance and seamless data transmission. With a compact design and advanced technology, the GD65232PWG4 provides value, efficiency, and convenience for customers seeking superior connectivity solutions. Trust Texas Instruments for cutting-edge innovations that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the components, making the unit easy to handle and install.

Surface Mount: YES

Allows for easy and secure mounting on a PCB, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

Supports a wide range of input voltages, making the unit versatile and compatible with various systems.

No. of Functions: 3

Offers multiple functions in a single device, reducing the need for additional components and simplifying circuit design.

Maximum Transmit Delay: 175 ns

Provides fast transmission speeds, ensuring efficient data transfer in high-speed applications.

Maximum Supply Voltage-1: 15 V

Allows for higher voltage operation when needed, providing flexibility in different power supply configurations.

Power Supplies (V): 5,+-9/+-12

Supports multiple power supply voltages, enabling compatibility with a wide range of systems and applications.

No. of Terminals: 20

Offers multiple terminals for easy connection and integration into circuits, enhancing versatility and flexibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact design with small footprint, making it suitable for space-constrained applications.

Minimum Supply Voltage-1: 7.5 V

Supports lower voltage operation when needed, allowing for efficient power usage in different scenarios.

Maximum High Level Input Current: 0.00001 Amp

Provides low input current requirements, minimizing power consumption and heat dissipation.

Minimum Supply Voltage: 4.5 V

Supports operation at lower voltage levels, offering flexibility in power supply options.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, ensuring reliable performance under varying conditions.

Minimum Operating Temperature: -40 °C

Offers reliable operation in extreme cold temperatures, making it suitable for a wide range of environments.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit layout and connection options.

Maximum Seated Height: 1.2 mm

Low profile design for space-saving installation in compact devices.

Width: 4.4 mm

Compact width for easy integration into tight spaces and dense PCB layouts.

Maximum Output Low Current: 10 Amp

Capable of driving high current loads, making it suitable for power-demanding applications.

Receiver No. of Bits: 5

Supports high-resolution data reception, ensuring accuracy in signal processing.

Length: 6.5 mm

Compact length for space-efficient installation in various devices.

Minimum Out Swing: 12 V

Supports high output swing for strong signal transmission and reception.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, ensuring performance in harsh environments.

Maximum Receive Delay: 150 ns

Fast receive delay for efficient data reception and processing.

Technology: BIPOLAR

Utilizes bipolar technology for high-speed operation and reliable performance.

Terminal Form: GULL WING

Gull wing terminals for secure and reliable connections to the PCB.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliant with industry standards for seamless integration into various communication systems.

Input Characteristics: SCHMITT TRIGGER

Utilizes Schmitt trigger input for noise immunity and signal stability.

Nominal Supply Voltage: 5 V

Nominal supply voltage for stable and efficient operation in standard conditions.

Nominal Negative Supply Voltage: -9 V

Supports negative supply voltage for dual-polarity power supply configurations.

Terminal Pitch: 0.65 mm

Fine terminal pitch for compact design and high-density PCB integration.

Nominal Supply Voltage-1: 9 V

Nominal supply voltage for stable and efficient operation in specific conditions.

Driver No. of Bits: 3

Supports multi-bit data transmission for versatile signal processing capabilities.

Interface IC Type: LINE TRANSCEIVER

Integrated line transceiver for reliable data transmission and reception in communication systems.

Technical Specifications

Line Drivers & Receivers GD65232PWG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

EASY INTERFACE BETWEEN UART, SERIAL-PORT CONNECTOR OF IBM PC/AT

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Nominal Negative Supply Voltage:

-9 V

No. of Functions:

3

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

12 V

Maximum Output Low Current:

10 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5,+-9/+-12

Qualification:

Not Qualified

Maximum Receive Delay:

150 ns

Receiver No. of Bits:

5

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

15 V

Minimum Supply Voltage-1:

7.5 V

Nominal Supply Voltage-1:

9 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

175 ns

Width:

4.4 mm

Trade Compliance

GD65232PWG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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