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GD65232DBRG4

Texas Instruments

GD65232DBRG4 by Texas Instruments

GD65232DBRG4 by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at temperatures from -40 to 85 °C. It has a max supply voltage of 5.5 V and can handle power supplies of 5, +-9/+-12 V. This IC is ideal for industrial applications requiring EIA-232-F, TIA-232-F, and V.28 interface standards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,028 parts In-Stock

1+ parts

-

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6,028

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Digiode

USA . 2,154 parts In-Stock

1+ parts

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2,154

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 403 parts In-Stock

1+ parts

$5.363

100+ parts

-

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403

$5.363

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One Stop Electronics

USA . 1,235 parts In-Stock

1+ parts

$7.500

100+ parts

-

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1,235

$7.500

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Parana Technologies

USA . 534 parts In-Stock

1+ parts

$7.642

100+ parts

$709.633

1k+ parts

$6.877

10k+ parts

-

534

$7.642

$709.633

$6.877

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DigiPath Technology Company

USA . 1,365 parts In-Stock

1+ parts

$8.414

100+ parts

$7.741

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-

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1,365

$8.414

$7.741

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ChromeModa Solutions

Germany . 6,738 parts In-Stock

1+ parts

$8.586

100+ parts

$7.041

1k+ parts

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6,738

$8.586

$7.041

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IDEA Electronic Components Group

UK . 1,051 parts In-Stock

1+ parts

$8.586

100+ parts

$8.157

1k+ parts

$7.727

10k+ parts

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1,051

$8.586

$8.157

$7.727

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Component Stockers USA

USA . 257 parts In-Stock

1+ parts

$99.990

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257

$99.990

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Corphita

USA . 1,810 parts In-Stock

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1,810

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Native Components

USA . 770 parts In-Stock

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$3.222

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770

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$3.222

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Microchip USA

USA . 433 parts In-Stock

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433

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Northwest PG Solutions

USA . 396 parts In-Stock

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$3.255

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396

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$3.255

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Overview

Elevate your communication systems with the GD65232DBRG4 by Texas Instruments, a top-of-the-line line driver and receiver that guarantees unparalleled quality and reliability. With a reputation for excellence in the industry, Texas Instruments delivers cutting-edge technology that exceeds expectations. Ideal for a range of applications, this product offers seamless integration, optimal performance, and maximum efficiency. Invest in the GD65232DBRG4 to experience the value, benefits, and advantages that only Texas Instruments can provide. Trust in Texas Instruments to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the product from damage, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy installation and integration into circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 5.5 V

Provides compatibility with a wide range of voltage inputs, increasing the versatility of the product.

No. of Functions: 3

Multiple functions in a single device offer cost-effectiveness and simplify the design and implementation of circuit systems.

Maximum Transmit Delay: 175 ns

Fast transmit delay ensures efficient data transfer and communication within the circuit.

Maximum Supply Voltage-1: 15 V

Ability to handle high supply voltages makes the product suitable for a variety of applications and environments.

Power Supplies (V): 5,+-9/+-12

Supports multiple power supply options, providing flexibility and compatibility with different power sources.

No. of Terminals: 20

Sufficient terminals for connectivity and interfaces, enabling seamless integration into complex circuit systems.

Technology: BIPOLAR

Bipolar technology ensures reliable and stable performance in various operating conditions, enhancing the product's overall efficiency and functionality.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Compliance with industry-standard interfaces ensures interoperability and compatibility with a wide range of devices and systems.

Technical Specifications

Line Drivers & Receivers GD65232DBRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

EASY INTERFACE BETWEEN UART, SERIAL-PORT CONNECTOR OF IBM PC/AT

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

Nominal Negative Supply Voltage:

-9 V

No. of Functions:

3

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

12 V

Maximum Output Low Current:

10 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5,+-9/+-12

Qualification:

Not Qualified

Maximum Receive Delay:

150 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

38 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

15 V

Minimum Supply Voltage-1:

7.5 V

Nominal Supply Voltage-1:

9 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

175 ns

Width:

5.3 mm

Trade Compliance

GD65232DBRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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