Loading...

FX053013

Texas Instruments

FX053013 by Texas Instruments

The Texas Instruments FX053013 microprocessor features a 32-bit architecture with integrated cache and 16-bit address and data bus width. It is designed for low power applications, with a max clock frequency of 26 MHz. This microprocessor is ideal for use in compact devices requiring high performance within a limited space.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,252

-

-

-

-

Digiode

USA . 650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

650

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 477 parts In-Stock

1+ parts

$1.510

100+ parts

-

1k+ parts

-

10k+ parts

-

477

$1.510

-

-

-

Northwest PG Solutions

USA . 845 parts In-Stock

1+ parts

$1.661

100+ parts

-

1k+ parts

-

10k+ parts

-

845

$1.661

-

-

-

AZTECH Wire

Italy . 716 parts In-Stock

1+ parts

$13.737

100+ parts

-

1k+ parts

-

10k+ parts

-

716

$13.737

-

-

-

One Stop Electronics

USA . 593 parts In-Stock

1+ parts

$31.000

100+ parts

-

1k+ parts

-

10k+ parts

-

593

$31.000

-

-

-

Parana Technologies

USA . 42 parts In-Stock

1+ parts

$72.070

100+ parts

-

1k+ parts

-

10k+ parts

-

42

$72.070

-

-

-

ChromeModa Solutions

Germany . 3,706 parts In-Stock

1+ parts

$80.978

100+ parts

$66.402

1k+ parts

-

10k+ parts

-

3,706

$80.978

$66.402

-

-

IDEA Electronic Components Group

UK . 566 parts In-Stock

1+ parts

$80.978

100+ parts

$76.929

1k+ parts

$72.880

10k+ parts

-

566

$80.978

$76.929

$72.880

-

iodParts Technologies Inc.

India . 5,630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,630

-

-

-

-

DigiPath Technology Company

USA . 649 parts In-Stock

1+ parts

-

100+ parts

$73.010

1k+ parts

-

10k+ parts

-

649

-

$73.010

-

-

Corphita

USA . 419 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

419

-

-

-

-

Overview

Looking for a high-quality microprocessor for your next project? Look no further than the FX053013 by Texas Instruments. With integrated cache and a 32-bit size, this microprocessor offers top-notch performance for a wide range of applications. From industrial automation to consumer electronics, this product delivers value and reliability. Trust in Texas Instruments' reputation for excellence and choose the FX053013 for all your microprocessing needs. Upgrade your technology with the best in the business.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material helps in providing durability and protection to the microprocessor, making it suitable for various environments.

Integrated Cache: YES

Having an integrated cache improves the overall performance of the microprocessor by reducing the access time to frequently used data, enhancing speed and efficiency.

Surface Mount: YES

Surface mount packaging allows for easy and convenient installation of the microprocessor on a circuit board, saving space and simplifying manufacturing processes.

Address Bus Width: 16

A wider address bus width of 16 allows the microprocessor to easily access and manage larger amounts of memory, enhancing its capabilities in handling complex tasks and data.

Package Shape: SQUARE

The square package shape provides symmetric dimensions and efficient use of space, making it compatible with various mounting configurations and board layouts.

Bit Size: 32

With a bit size of 32, the microprocessor can handle and process data in 32-bit chunks, improving overall performance and efficiency in executing instructions and calculations.

No. of Terminals: 298

Having 298 terminals enables the microprocessor to effectively communicate and interface with other components, supporting connectivity and functionality in electronic devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers a high-density and compact design, optimizing space utilization and enabling high-speed data transmission.

Maximum Operating Temperature: 90 °C

A high maximum operating temperature of 90°C ensures reliable performance even in challenging thermal conditions, making the microprocessor suitable for use in various applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows the microprocessor to function effectively in cold environments without compromising performance or reliability.

Terminal Finish: TIN SILVER COPPER

The terminal finish of TIN SILVER COPPER provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections and long-term usability of the microprocessor.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure attachment of the microprocessor to the circuit board, improving overall stability and connectivity in electronic systems.

Maximum Seated Height: 1.3 mm

A low maximum seated height of 1.3 mm allows for a slim and compact profile, enabling the microprocessor to be integrated into space-constrained devices and applications.

Width: 13 mm

With a width of 13 mm, the microprocessor can fit into narrow spaces and compact designs, ensuring compatibility with various form factors and board layouts.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the microprocessor during production and maintenance, ensuring high quality and reliability of electronic devices.

External Data Bus Width: 16

An external data bus width of 16 allows for fast and efficient data transfer between the microprocessor and external devices, enhancing overall system performance and responsiveness.

Maximum Clock Frequency: 26 MHz

The maximum clock frequency of 26 MHz enables the microprocessor to perform tasks at high speeds, supporting rapid data processing and real-time computing requirements.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the microprocessor ensures reliable soldering and assembly processes, minimizing the risk of overheating or damage.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for secure and effective soldering of the microprocessor onto the circuit board, ensuring stable connections and long-term reliability.

Length: 13 mm

A length of 13 mm provides a compact and space-efficient form factor for the microprocessor, allowing for versatile installation and integration in a wide range of electronic devices.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor type, it offers simplified instruction set architecture, high performance, and energy efficiency, making it ideal for demanding computing tasks and applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, enhancing the overall efficiency and performance of the microprocessor in various electronic applications.

Terminal Form: BALL

Ball terminal form ensures secure and reliable connections between the microprocessor and the circuit board, offering stability and durability in challenging operating conditions.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, the microprocessor supports fine-pitch soldering, enabling high-density mounting and improved signal integrity in electronic systems.

Format: FIXED POINT

Fixed-point format allows for precise arithmetic operations and accurate numerical calculations, enhancing the computational accuracy and performance of the microprocessor.

Moisture Sensitivity Level (MSL): 3

Having an MSL of 3 indicates that the microprocessor can withstand moderate exposure to moisture during storage and handling, ensuring reliable operation in varied environmental conditions.

Low Power Mode: YES

The low power mode feature helps in optimizing energy consumption and extending battery life, making the microprocessor suitable for power-efficient devices and applications.

Technical Specifications

Microprocessors FX053013 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B298

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

298

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

FX053013 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7