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DS99R101VS

Texas Instruments

DS99R101VS by Texas Instruments

DS99R101VS by Texas Instruments is a 48-terminal line driver with CMOS technology. It operates b/w 0-70 °C and has a supply voltage range of 3-3.6 V. Ideal for applications requiring differential input characteristics and a compact, thin profile package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,447 parts In-Stock

1+ parts

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4,447

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Vyrian

USA . 2,781 parts In-Stock

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2,781

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Anansix

USA . 1,425 parts In-Stock

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1,425

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Distributors (Availability)

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Parana Technologies

USA . 2,064 parts In-Stock

1+ parts

$7.820

100+ parts

-

1k+ parts

$8.373

10k+ parts

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2,064

$7.820

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$8.373

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DigiPath Technology Company

USA . 1,460 parts In-Stock

1+ parts

$8.611

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1,460

$8.611

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ChromeModa Solutions

Germany . 2,831 parts In-Stock

1+ parts

$8.787

100+ parts

$7.205

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2,831

$8.787

$7.205

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IDEA Electronic Components Group

UK . 711 parts In-Stock

1+ parts

$8.787

100+ parts

$8.348

1k+ parts

$7.908

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-

711

$8.787

$8.348

$7.908

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AZTECH Wire

Italy . 341 parts In-Stock

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$12.980

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341

$12.980

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One Stop Electronics

USA . 419 parts In-Stock

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$20.500

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419

$20.500

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Native Components

USA . 215 parts In-Stock

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$48.290

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$46.358

215

$48.290

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$46.358

Northwest PG Solutions

USA . 1,982 parts In-Stock

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$53.119

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1,982

$53.119

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Alle Elektronik GmbH

Germany . 3,875 parts In-Stock

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3,875

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Corphita

USA . 3,827 parts In-Stock

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3,827

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Kepictronics

USA . 65 parts In-Stock

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65

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Perfect Parts

USA . 22 parts In-Stock

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22

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Overview

Experience top-notch performance with the Texas Instruments DS99R101VS line driver & receiver. Manufactured by a trusted industry leader, this product offers exceptional value and reliability. Ideal for a wide range of applications, this device provides seamless communication and robust signal integrity. Trust in Texas Instruments to deliver cutting-edge technology that surpasses expectations. Elevate your projects with the DS99R101VS and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer product lifespan.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Supports higher voltage requirements, making it suitable for a wide range of applications.

Package Shape: SQUARE

Facilitates efficient and compact PCB layout, optimizing space usage within electronic devices.

No. of Terminals: 48

Provides multiple connection points for enhanced functionality and connectivity.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Enables a sleek and slim design, ideal for space-constrained applications.

Minimum Supply Voltage: 3 V

Supports lower voltage requirements, offering flexibility in power supply options.

Maximum Operating Temperature: 70 °C

Ensures reliable performance in high-temperature environments, enhancing product durability.

Minimum Operating Temperature: 0 °C

Can operate in cold conditions, making it suitable for a variety of climate settings.

Terminal Finish: TIN LEAD

Provides corrosion resistance and reliable electrical connections for long-term use.

Terminal Position: QUAD

Allows for efficient circuit board layout and easy identification of terminals.

Maximum Seated Height: 1.2 mm

Enables a low-profile design, ideal for compact electronic devices and tight spaces.

Width: 7 mm

Compact dimensions make it suitable for small form factor applications.

Differential Output: YES

Provides superior signal integrity and noise immunity for high-quality data transmission.

Length: 7 mm

Compact dimensions make it suitable for small form factor applications.

Temperature Grade: COMMERCIAL

Suitable for standard commercial use in various industries.

Technology: CMOS

Utilizes low power consumption and high noise tolerance for efficient operation.

Terminal Form: GULL WING

Facilitates easy soldering and secure connections during assembly.

Input Characteristics: DIFFERENTIAL

Enables precise data transmission and reception with reduced signal interference.

Nominal Supply Voltage: 3.3 V

Optimal voltage level for reliable and stable device operation.

Terminal Pitch: 0.5 mm

Fine pitch spacing allows for high-density mounting on PCBs, saving space and improving signal integrity.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture exposure, ensuring operational reliability in various environmental conditions.

Interface IC Type: LINE DRIVER

Specifically designed for driving communication signals, ensuring efficient data transmission in various applications.

Technical Specifications

Line Drivers & Receivers DS99R101VS attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e0

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Receiver No. of Bits:

1

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

DS99R101VS Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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