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DS99R103TSQX

Texas Instruments

DS99R103TSQX by Texas Instruments

DS99R103TSQX by Texas Instruments is a CMOS Line Driver with 48 terminals, operating at -40 to 85 °C. It has a differential output and input characteristics, suitable for industrial applications requiring a max supply voltage of 3.6 V. The package style is chip carrier with a very thin profile, making it ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,276 parts In-Stock

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Digiode

USA . 5,105 parts In-Stock

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Anansix

USA . 620 parts In-Stock

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620

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Parana Technologies

USA . 1,216 parts In-Stock

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$1.801

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$2.359

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$1.801

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DigiPath Technology Company

USA . 200 parts In-Stock

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$1.984

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$1.825

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200

$1.984

$1.825

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IDEA Electronic Components Group

UK . 818 parts In-Stock

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$2.024

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$1.822

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818

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ChromeModa Solutions

Germany . 262 parts In-Stock

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$2.024

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$1.660

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$2.024

$1.660

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AZTECH Wire

Italy . 811 parts In-Stock

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$7.266

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One Stop Electronics

USA . 1,025 parts In-Stock

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$32.500

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Northwest PG Solutions

USA . 2,113 parts In-Stock

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Corphita

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Native Components

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Overview

Elevate your communication systems with the Texas Instruments DS99R103TSQX Line Driver & Receiver. Crafted with precision and expertise, this product guarantees top-notch quality and unparalleled performance. From industrial applications to consumer electronics, this versatile device is designed to meet all your connectivity needs. With a maximum supply voltage of 3.6V and a compact square package shape, the DS99R103TSQX offers reliability and efficiency like no other. Trust in Texas Instruments for cutting-edge technology that delivers value, benefits, and advantages to customers seeking excellence in their projects.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy installation on circuit boards, making it convenient and space-saving.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing flexibility in various applications.

Package Shape: SQUARE

Square packages are typically more compact, making efficient use of space on a PCB.

No. of Terminals: 48

Having a higher number of terminals allows for more connections and versatility in setups.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments where temperature variations may occur, ensuring reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Nominal Supply Voltage: 3.3 V

Close to the maximum supply voltage, providing stable operation within the specified range.

Technical Specifications

Line Drivers & Receivers DS99R103TSQX attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e0

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Receiver No. of Bits:

1

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

DS99R103TSQX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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