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DS99R102VSX

Texas Instruments

DS99R102VSX by Texas Instruments

DS99R102VSX by Texas Instruments is a 48-terminal line receiver with CMOS technology. It operates b/w 0-70°C, with a supply voltage range of 3-3.6V. Ideal for applications requiring differential input characteristics and a compact thin profile package design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,286 parts In-Stock

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Digiode

USA . 1,765 parts In-Stock

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Anansix

USA . 1,028 parts In-Stock

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Native Components

USA . 986 parts In-Stock

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$1.129

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Northwest PG Solutions

USA . 688 parts In-Stock

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$1.242

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Parana Technologies

USA . 1,405 parts In-Stock

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$2.637

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$244.892

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$2.373

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DigiPath Technology Company

USA . 2,349 parts In-Stock

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$2.904

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$2.671

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IDEA Electronic Components Group

UK . 2,256 parts In-Stock

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$2.963

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$2.667

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ChromeModa Solutions

Germany . 211 parts In-Stock

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$2.430

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AZTECH Wire

Italy . 373 parts In-Stock

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$16.289

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One Stop Electronics

USA . 1,268 parts In-Stock

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Corphita

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Overview

Discover the ultimate solution for your line driver and receiver needs with the DS99R102VSX from Texas Instruments. This high-quality product offers unparalleled performance and reliability, perfect for a wide range of applications. With its advanced technology and commercial-grade components, customers can trust in the value and benefits this product brings to their projects. Upgrade to the DS99R102VSX today and experience the difference that Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while ensuring long-term reliability.

Surface Mount: YES

This feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage tolerance allows for reliable operation in systems with varying power requirements.

Package Shape: SQUARE

The square shape provides uniformity and ease of integration into compact designs or layouts.

No. of Terminals: 48

The high number of terminals allows for versatile connectivity options and signal routing, catering to complex circuit configurations.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

This packaging style ensures efficient use of space, making the product suitable for compact electronics with limited real estate.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement enables operation in low-power environments or energy-efficient applications.

Maximum Operating Temperature: 70 °C

The product can withstand high operating temperatures, ensuring reliable performance in demanding industrial or automotive environments.

Minimum Operating Temperature: 0 °C

The product can operate effectively in cold temperatures, making it suitable for outdoor or harsh climate conditions.

Terminal Finish: TIN LEAD

The tin lead finish provides corrosion resistance and solderability, ensuring long-term stability and ease of assembly.

Terminal Position: QUAD

The quad terminal layout facilitates efficient signal routing and reduces signal interference, enhancing overall performance.

Maximum Seated Height: 1.2 mm

The low seated height allows for slim and compact designs, ideal for space-constrained applications.

Width: 7 mm

The compact width enables easy integration into crowded circuit layouts or tight spaces, enhancing design flexibility.

Differential Output: YES

The differential output helps in reducing noise and interference, improving signal integrity and overall system performance.

Length: 7 mm

The short length contributes to the product's compact form factor, making it suitable for smaller electronic devices or assemblies.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation in standard operating conditions, suited for typical commercial applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and reliability during soldering or board mounting processes, enhancing product durability.

Input Characteristics: DIFFERENTIAL

The differential input enables better noise rejection and signal integrity, ensuring accurate data transmission in high-noise environments.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage offers compatibility with standard power sources, providing a reliable power input for optimal performance.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting, enabling the product to be used in space-constrained designs or applications.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product can withstand moderate exposure to moisture during assembly or operation, ensuring reliability in various environments.

Interface IC Type: LINE RECEIVER

The interface IC type of line receiver enables the product to receive and interpret signals accurately, making it suitable for data transmission applications.

Technical Specifications

Line Drivers & Receivers DS99R102VSX attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e0

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Receiver No. of Bits:

1

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

DS99R102VSX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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