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DS90CP22MX-8

Texas Instruments

DS90CP22MX-8 by Texas Instruments

DS90CP22MX-8 by Texas Instruments is a CMOS Cross Point Switch with 2 functions, 16 terminals, and 3.3V supply voltage. Ideal for industrial applications, it operates b/w -40 to 85°C and features a small outline package style for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 3,129 parts In-Stock

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Vyrian

USA . 2,889 parts In-Stock

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Bristol Electronics

USA . 2,500 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,437 parts In-Stock

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Digiode

USA . 1,589 parts In-Stock

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Legend Electronics Inc.

USA . 1,529 parts In-Stock

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Anansix

USA . 1,122 parts In-Stock

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Native Components

USA . 835 parts In-Stock

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$0.540

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Northwest PG Solutions

USA . 629 parts In-Stock

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$0.594

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One Stop Electronics

USA . 1,500 parts In-Stock

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$3.500

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AZTECH Wire

Italy . 353 parts In-Stock

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$12.394

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Parana Technologies

USA . 1,582 parts In-Stock

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$19.881

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$19.835

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ChromeModa Solutions

Germany . 5,489 parts In-Stock

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$22.338

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$18.317

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IDEA Electronic Components Group

UK . 1,637 parts In-Stock

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Lixinc

USA . 6,513 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 4,278 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,426 parts In-Stock

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Kepictronics

USA . 2,800 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,437 parts In-Stock

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GreenTree Electronics

Israel . 2,097 parts In-Stock

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Assy Fe

Spain . 1,571 parts In-Stock

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DigiPath Technology Company

USA . 1,284 parts In-Stock

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$20.140

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Overview

Experience seamless connectivity and superior performance with the DS90CP22MX-8 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments provides top-notch quality products that excel in various applications. The DS90CP22MX-8 is a game-changer in the Multiplexers & Switches category, offering customers unmatched value and benefits. Its compact design, high reliability, and exceptional functionality make it a must-have for any project requiring precision and efficiency. Upgrade your system today with the DS90CP22MX-8 and experience unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easier to handle and less prone to damage during transportation and usage.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards, saving time and ensuring a secure connection.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is commonly used in many electronic systems, making this product compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand extended use in various environments without risk of overheating or malfunction.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable for long-term use.

Technical Specifications

Multiplexers & Switches DS90CP22MX-8 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer or Switches

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width (mm):

3.9 mm

Trade Compliance

DS90CP22MX-8 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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