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DS560MB410ZAST

Texas Instruments

DS560MB410ZAST by Texas Instruments

DS560MB410ZAST by Texas Instruments is a 4-channel LINE RECEIVER with 2.375-2.625 V supply voltage range, suitable for applications requiring differential input characteristics. It features a 101-terminal GRID ARRAY package in PLASTIC/EPOXY material, operating b/w -40 to 85 °C temperature range.

Median Price

$51.490

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,043 parts In-Stock

1+ parts

$40.392

100+ parts

$35.904

1k+ parts

$26.400

10k+ parts

-

2,043

$40.392

$35.904

$26.400

-

Mouser Electronics

USA . 233 parts In-Stock

1+ parts

$51.490

100+ parts

$37.500

1k+ parts

$37.320

10k+ parts

-

233

$51.490

$37.500

$37.320

-

DigiKey

USA . 203 parts In-Stock

1+ parts

$51.490

100+ parts

$37.496

1k+ parts

$36.295

10k+ parts

-

203

$51.490

$37.496

$36.295

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,945 parts In-Stock

1+ parts

$38.372

100+ parts

-

1k+ parts

-

10k+ parts

-

3,945

$38.372

-

-

-

Vyrian

USA . 5,739 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,739

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 96 parts In-Stock

1+ parts

$1.158

100+ parts

-

1k+ parts

-

10k+ parts

-

96

$1.158

-

-

-

Northwest PG Solutions

USA . 1,236 parts In-Stock

1+ parts

$1.274

100+ parts

-

1k+ parts

-

10k+ parts

-

1,236

$1.274

-

-

-

Semicontronic

India . 612 parts In-Stock

1+ parts

$34.330

100+ parts

$33.472

1k+ parts

$33.300

10k+ parts

-

612

$34.330

$33.472

$33.300

-

Ampacity Inc.

Singapore . 372 parts In-Stock

1+ parts

$34.330

100+ parts

-

1k+ parts

-

10k+ parts

-

372

$34.330

-

-

-

Corphita

USA . 3,933 parts In-Stock

1+ parts

$36.353

100+ parts

-

1k+ parts

-

10k+ parts

-

3,933

$36.353

-

-

-

Corohmni

South Africa . 359 parts In-Stock

1+ parts

$40.392

100+ parts

-

1k+ parts

-

10k+ parts

-

359

$40.392

-

-

-

Microchip USA

USA . 2,632 parts In-Stock

1+ parts

$85.860

100+ parts

$84.360

1k+ parts

$83.620

10k+ parts

$82.870

2,632

$85.860

$84.360

$83.620

$82.870

Overview

Elevate your electronic designs with the Texas Instruments DS560MB410ZAST line receiver. Known for their superior quality and reliability, Texas Instruments offers cutting-edge technology in the field of Line Drivers & Receivers. This versatile product boasts 4 functions, 4 channels, and a wide operating temperature range, making it ideal for a variety of applications. With its compact square package and advanced features, this line receiver delivers exceptional value and performance to customers seeking top-notch connectivity solutions. Experience the benefits of Texas Instruments' innovation with the DS560MB410ZAST.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components due to its durability and resistance to heat and chemicals, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for efficient and compact placement on PCBs, saving space and enhancing the overall design of the product.

Maximum Supply Voltage: 2.625 V

With a high maximum supply voltage, this product can easily operate within standard voltage ranges, providing flexibility and compatibility with various systems.

No. of Functions: 4

Having multiple functions integrated into one device simplifies system design and reduces the need for additional components, leading to cost savings and improved efficiency.

Package Shape: SQUARE

The square shape allows for easy handling and alignment during assembly, ensuring a seamless integration process and reliable performance.

No. of Terminals: 101

A higher number of terminals provide more connectivity options, enabling versatile applications and enhancing the product's compatibility with a wide range of systems.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style offers a compact design with precise terminal spacing, facilitating high-density PCB layouts and improving signal integrity in complex electronic systems.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage ensures efficient power consumption and operation at lower voltages, making the product energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and maintain stable performance in demanding applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the product to function reliably in extreme cold environments, offering versatility and durability in various operating conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable signal transmission and long-term durability of the product.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and soldering processes, enhancing ease of assembly and maintaining a compact form factor for the product.

Maximum Seated Height: 1.2 mm

The low seated height allows for a slim profile and efficient space utilization on the PCB, enabling compact system designs without compromising performance.

Width: 6 mm

The compact width of the product facilitates versatile mounting options and allows for efficient placement in space-constrained applications, maximizing design flexibility.

Receiver No. of Bits: 4

With 4 bits of receiver capability, this product offers sufficient data processing and communication capabilities for various digital signals, ensuring reliable and accurate data transmission.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can undergo robust manufacturing processes, such as solder reflow, ensuring reliable and consistent solder joints for secure connections.

Length: 6 mm

The compact length of the product contributes to a space-efficient design and easy integration into tight layouts, enhancing system performance without sacrificing form factor.

No. of Channels: 4

Having 4 channels enables simultaneous data transmission and reception across multiple signal paths, promoting efficient communication and data exchange in complex systems.

Terminal Form: BALL

The ball terminal form offers reliable connections and secure attachment to the PCB, ensuring stable signal transmission and durable performance in various operating conditions.

Input Characteristics: DIFFERENTIAL

Differential input characteristics provide superior noise immunity and signal integrity, allowing the product to effectively filter out interference and maintain high-quality communication in noisy environments.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage ensures consistent and stable operation within the specified voltage range, guaranteeing reliable performance and compatibility with standard power sources.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and precise component placement on the PCB, optimizing signal routing and enhancing overall system efficiency.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product can withstand moderate exposure to moisture during handling and storage, ensuring reliability and longevity in various environments.

Interface IC Type: LINE RECEIVER

Being a line receiver interface IC type, this product offers enhanced signal reception and amplification capabilities for robust communication in data transmission systems, ensuring clear and accurate data reception.

Technical Specifications

Line Drivers & Receivers DS560MB410ZAST attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

JESD-30 Code:

S-PBGA-B101

JESD-609 Code:

e1

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

101

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA101,11X11,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Receiver No. of Bits:

4

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

DS560MB410ZAST Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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