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DS560MB410ZASR

Texas Instruments

DS560MB410ZASR by Texas Instruments

DS560MB410ZASR by Texas Instruments is a 4-channel LINE RECEIVER with 2.375-2.625 V supply voltage range, operating from -40 to 85 °C. It features a GRID ARRAY package style, suitable for applications requiring high-speed data transmission in compact spaces.

Median Price

$24.480

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,485 parts In-Stock

1+ parts

$24.480

100+ parts

$21.760

1k+ parts

$16.000

10k+ parts

-

19,485

$24.480

$21.760

$16.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,578 parts In-Stock

1+ parts

$23.256

100+ parts

-

1k+ parts

-

10k+ parts

-

2,578

$23.256

-

-

-

Vyrian

USA . 6,886 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,886

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 775 parts In-Stock

1+ parts

$5.160

100+ parts

-

1k+ parts

-

10k+ parts

-

775

$5.160

-

-

-

AZTECH Wire

Italy . 281 parts In-Stock

1+ parts

$14.090

100+ parts

-

1k+ parts

-

10k+ parts

-

281

$14.090

-

-

-

Ampacity Inc.

Singapore . 19,408 parts In-Stock

1+ parts

$20.810

100+ parts

-

1k+ parts

-

10k+ parts

-

19,408

$20.810

-

-

-

Semicontronic

India . 19,264 parts In-Stock

1+ parts

$20.810

100+ parts

$20.290

1k+ parts

$20.186

10k+ parts

-

19,264

$20.810

$20.290

$20.186

-

Corphita

USA . 880 parts In-Stock

1+ parts

$22.032

100+ parts

-

1k+ parts

-

10k+ parts

-

880

$22.032

-

-

-

Corohmni

South Africa . 463 parts In-Stock

1+ parts

$24.480

100+ parts

-

1k+ parts

-

10k+ parts

-

463

$24.480

-

-

-

Microchip USA

USA . 1,448 parts In-Stock

1+ parts

$46.830

100+ parts

$46.020

1k+ parts

$45.610

10k+ parts

$45.200

1,448

$46.830

$46.020

$45.610

$45.200

Northwest PG Solutions

USA . 1,716 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.057

10k+ parts

-

1,716

-

-

$5.057

-

Overview

Discover the innovative DS560MB410ZASR by Texas Instruments, a cutting-edge Line Driver & Receiver designed to deliver top-notch performance and reliability. With its high-quality plastic/epoxy construction and advanced features, this product is ideal for a wide range of applications. From communication systems to industrial machinery, this versatile device offers seamless integration and superior functionality. Experience the value and benefits of Texas Instruments' expertise in semiconductor manufacturing with the DS560MB410ZASR, providing customers with unmatched quality and efficiency. Elevate your projects with this exceptional solution that ensures optimal performance and reliability in every use case.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external factors, making the product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easier and more efficient installation, reducing assembly time and complexity.

Maximum Supply Voltage: 2.625 V

The high maximum supply voltage ensures compatibility with a wide range of systems and power sources.

No. of Functions: 4

Having multiple functions in a single device provides versatility and functionality, making it a cost-effective choice for users.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into circuit layouts.

No. of Terminals: 101

The large number of terminals enables connectivity with multiple components, expanding the product's application range.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch design enhance signal integrity, reduce crosstalk, and improve overall performance.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage ensures efficient power consumption and operation in low-power environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in demanding conditions and extended usage periods.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold environments without affecting performance.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position allows for easy access and connection, simplifying installation and maintenance processes.

Maximum Seated Height: 1.2 mm

The low maximum seated height saves space and enables compact device designs without compromising performance.

Width: 6 mm

The compact width makes the product suitable for tight spaces and small electronic devices, maximizing flexibility in design.

Receiver No. of Bits: 4

The 4-bit receiver allows for accurate and efficient data transmission, making it ideal for applications requiring precise signals.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures secure solder connections during assembly and maintenance procedures.

Length: 6 mm

The short length enables space-saving designs and easy integration into various electronic systems.

No. of Channels: 4

Having 4 channels provides the capability to handle multiple signals simultaneously, enhancing the product's functionality.

Terminal Form: BALL

The ball terminal form offers secure connections and efficient heat dissipation, enhancing overall reliability and performance.

Input Characteristics: DIFFERENTIAL

The differential input characteristics enable noise rejection and signal integrity, ensuring accurate data transmission in noisy environments.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage provides a stable power source for consistent performance and reliable operation.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting, saving space and enabling complex circuit designs in limited areas.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product has moderate sensitivity to moisture exposure, suitable for use in controlled environments.

Interface IC Type: LINE RECEIVER

The use of a line receiver interface IC type ensures compatibility and seamless integration with various communication systems and devices.

Technical Specifications

Line Drivers & Receivers DS560MB410ZASR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

JESD-30 Code:

S-PBGA-B101

JESD-609 Code:

e1

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

101

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA101,11X11,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Receiver No. of Bits:

4

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

DS560MB410ZASR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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